Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for preventing die pad delamination

Method for preventing die pad delamination

US Patent 9214440 · Granted Dec 15, 2015

Estimated economic value: $26,830,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for realizing high-speed cladding of hollow offset-focus annular laser2025
Integrated filter optical package2025
IC package with heat spreader2025
Package heat dissipation including a die attach film2025
QFN device having a mechanism that enables an inspectable solder joint when atta2024
Semiconductor die with stepped side surface2024
IC package with heat spreader2024
Integrated circuit chip with a vertical connector2023
Acoustic device package and method of making2023
Multi-lead adapter2023
Annular hollow offset-focus laser cladding device2023
Integrated circuit package electronic device2023