Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400872 | Sacrificial capping layer for gate protection | Yun Han, David L. O'Meara, Cheryl Alix, Shan Hu, Henan Zhang | 2025-08-26 |
| 12354842 | In-situ focus ring coating | Minjoon Park | 2025-07-08 |
| 12341009 | Variable hardness amorphous carbon mask | Shihsheng Chang, Yun Han, Ya-Ming Chen, Kai-Hung Yu, Eric Chih-Fang Liu | 2025-06-24 |
| 12334356 | Plasma etching tools and systems | Minjoon Park | 2025-06-17 |
| 12288692 | Method of forming a FET structure by selective deposition of film on source/drain contact | Yun Han, Alok Ranjan, Peter Ventzek, Hiroaki Niimi | 2025-04-29 |
| 12266534 | Forming a semiconductor device using a protective layer | Shihsheng Chang | 2025-04-01 |
| 12266533 | Sacrificial capping layer for contact etch | Yun Han, Peter Biolsi | 2025-04-01 |
| 12211911 | Recessed contact structures and methods | Caitlin Philippi, Sophie Thibaut | 2025-01-28 |
| 12191202 | Contact openings in semiconductor devices | Blaze Messer | 2025-01-07 |
| 12080599 | Methods for forming self-aligned contacts using spin-on silicon carbide | Junling Sun, Lior Huli, Angelique Raley | 2024-09-03 |
| 12040176 | Technologies for high aspect ratio carbon etching with inserted charge dissipation layer | Shihsheng Chang, Yun Han, Minjoon Park, Ya-Ming Chen | 2024-07-16 |
| 11978631 | Forming contact holes with controlled local critical dimension uniformity | Junling Sun, Katie Lutker-Lee, Angelique Raley | 2024-05-07 |
| 11961735 | Cyclic plasma processing | Yun Han, Caitlin Philippi, Alok Ranjan | 2024-04-16 |
| 11651967 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, David L. O'Meara, Yun Han | 2023-05-16 |
| 11538692 | Cyclic plasma etching of carbon-containing materials | Yunho Kim, Du Zhang, Shihsheng Chang, Mingmei Wang | 2022-12-27 |
| 11532517 | Localized etch stop layer | Yun Han, Xinghua Sun, David L. O'Meara, Kandabara Tapily, Henan Zhang +1 more | 2022-12-20 |
| 11495436 | Systems and methods to control critical dimension (CD) shrink ratio through radio frequency (RF) pulsing | Junling Sun, Angelique Raley | 2022-11-08 |
| 11482454 | Methods for forming self-aligned contacts using spin-on silicon carbide | Junling Sun, Lior Huli, Angelique Raley | 2022-10-25 |
| 11227774 | Methods and systems for etching silicon cyanide (SiCN) with multi-color selectivity | Shihsheng Chang | 2022-01-18 |
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, David L. O'Meara, Yun Han | 2021-12-07 |
| 11127594 | Manufacturing methods for mandrel pull from spacers for multi-color patterning | Xinghua Sun, Angelique Raley | 2021-09-21 |
| 11121027 | High aspect ratio via etch using atomic layer deposition protection layer | Yen-Tien Lu, Xinghua Sun, Eric Chih-Fang Liu | 2021-09-14 |
| 10950444 | Metal hard mask layers for processing of microelectronic workpieces | Yen-Tien Lu, Kai-Hung Yu | 2021-03-16 |
| 10950460 | Method utilizing using post etch pattern encapsulation | Angelique Raley, Cory Wajda, Junling Sun | 2021-03-16 |
| 10937659 | Method of anisotropically etching adjacent lines with multi-color selectivity | Shihsheng Chang | 2021-03-02 |