Peter Biolsi has been granted 11 US patents while listed as an inventor at IBM . The first was granted in 2002 and the most recent in December 2025. Peter Biolsi ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Peter Biolsi in Albany, NY, US.
Patents per Year Patents granted per year, 2002 to 2025 Bar chart with a peak of 3 patents in 2025. peak 3 2002: 1 patents 2002 2004: 1 patents 2004 2006: 2 patents 2006 2007: 1 patents 2007 2008: 1 patents 2008 2013: 2 patents 2013 2025: 3 patents 2025
Issued Patents All Time
Profile Widget
Showing 1–11 of 11 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
12506112 Method for etching of metal Sergey Voronin , Qing Wang , Christopher NETZBAND , Gabriel Gibney , Sanghoon Han +2 more 2025-12-23
12300500 Etching of polycrystalline semiconductors Yun Han , Alok Ranjan , Tomoyuki Oishi , Shuhei Ogawa , Ken Kobayashi 2025-05-13
12266533 Sacrificial capping layer for contact etch Yun Han , Andrew Metz 2025-04-01
8614150 Methods of manufacturing semiconductor structures using RIE process Samuel S. Choi , Kevin J. Mackey 2013-12-24
$7,453,000
8532796 Contact processing using multi-input/multi-output (MIMO) models Daniel Prager , Merritt Funk , Ryukichi Shimizu 2013-09-10
7442650 Methods of manufacturing semiconductor structures using RIE process Samuel S. Choi , Kevin J. Mackey 2008-10-28
$6,235,000
7214608 Interlevel dielectric layer and metal layer sealing Matthew S. Angyal , Lawrence A. Clevenger , Habib Hichri , Bernd Kastenmeier , Michael Lane +3 more 2007-05-08
$8,960,000
7045464 Via reactive ion etching process Samuel S. Choi 2006-05-16
$5,914,000
7030031 Method for forming damascene structure utilizing planarizing material coupled with diffusion barrier material William C. Wille , Daniel C. Edelstein , William J. Cote , John Fritche , Allan Upham 2006-04-18
$9,074,000
6677678 Damascene structure using a sacrificial conductive layer Gregory S. Jankowski , Laurie M. Krywanczyk , Anthony K. Stamper 2004-01-13
$10,539,000
6444557 Method of forming a damascene structure using a sacrificial conductive layer Gregory S. Jankowski , Laurie M. Krywanczyk , Anthony K. Stamper 2002-09-03
$9,688,000
