YH

Yun Han

TL Tokyo Electron Limited: 18 patents #330 of 5,567Top 6%
📍 Albany, NY: #95 of 790 inventorsTop 15%
🗺 New York: #7,917 of 115,490 inventorsTop 7%
Overall (All Time): #243,108 of 4,157,543Top 6%
18
Patents All Time

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #TitleCo-InventorsDate
12400872 Sacrificial capping layer for gate protection David L. O'Meara, Cheryl Alix, Andrew Metz, Shan Hu, Henan Zhang 2025-08-26
12341009 Variable hardness amorphous carbon mask Shihsheng Chang, Andrew Metz, Ya-Ming Chen, Kai-Hung Yu, Eric Chih-Fang Liu 2025-06-24
12300500 Etching of polycrystalline semiconductors Alok Ranjan, Tomoyuki Oishi, Shuhei Ogawa, Ken Kobayashi, Peter Biolsi 2025-05-13
12288692 Method of forming a FET structure by selective deposition of film on source/drain contact Alok Ranjan, Peter Ventzek, Andrew Metz, Hiroaki Niimi 2025-04-29
12266533 Sacrificial capping layer for contact etch Andrew Metz, Peter Biolsi 2025-04-01
12237216 Method for filling recessed features in semiconductor devices with a low-resistivity metal Kai-Hung Yu, Shihsheng Chang, Ying Trickett, Eric Chih-Fang Liu, Henan Zhang +5 more 2025-02-25
12189297 Methods for extreme ultraviolet (EUV) resist patterning development Peter L. G. Ventzek, Alok Ranjan 2025-01-07
12040176 Technologies for high aspect ratio carbon etching with inserted charge dissipation layer Shihsheng Chang, Andrew Metz, Minjoon Park, Ya-Ming Chen 2024-07-16
11961735 Cyclic plasma processing Caitlin Philippi, Andrew Metz, Alok Ranjan 2024-04-16
11942307 Plasma processing with radio frequency (RF) source and bias signal waveforms Zhiying Chen, Barton Lane, Peter Ventzek, Alok Ranjan 2024-03-26
11651967 Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch Shihsheng Chang, David L. O'Meara, Andrew Metz 2023-05-16
11605539 Defect correction on metal resists Peter L. G. Ventzek, Alok Ranjan 2023-03-14
11532517 Localized etch stop layer Andrew Metz, Xinghua Sun, David L. O'Meara, Kandabara Tapily, Henan Zhang +1 more 2022-12-20
11527413 Cyclic plasma etch process Peter L. G. Ventzek, Alok Ranjan 2022-12-13
11342195 Methods for anisotropic etch of silicon-based materials with selectivity to organic materials Peter Ventzek, Alok Ranjan 2022-05-24
11195723 Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch Shihsheng Chang, David L. O'Meara, Andrew Metz 2021-12-07
11094543 Defect correction on metal resists Peter Ventzek, Alok Ranjan 2021-08-17
11079682 Methods for extreme ultraviolet (EUV) resist patterning development Peter L. G. Ventzek, Alok Ranjan 2021-08-03