Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417925 | Method of conductive material deposition | Hirokazu Aizawa, Nicholas Joy, Yusuke Yoshida, Kandabara Tapily | 2025-09-16 |
| 12346386 | Visual and audio multimodal searching system | Harshit Kharbanda, Belinda Luna Zeng, Viviana Caso Corella, Christopher James Kelley, Jessica Lee +6 more | 2025-07-01 |
| 12341009 | Variable hardness amorphous carbon mask | Shihsheng Chang, Andrew Metz, Yun Han, Ya-Ming Chen, Eric Chih-Fang Liu | 2025-06-24 |
| 12321401 | Multimodal query prediction | Jessica Lee, Cindy L. Huynh, Harshit Kharbanda, Louis Wang, Richard Bruce Cameron +4 more | 2025-06-03 |
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Shihsheng Chang, Ying Trickett, Eric Chih-Fang Liu, Yun Han, Henan Zhang +5 more | 2025-02-25 |
| 12014718 | Feedback noise reduction method and system, and earphone | Ruohui Wang, Kai Wang | 2024-06-18 |
| 11839008 | Smart window and driving method thereof, and smart window system | Yongbo Wang, Chen Meng, Yiping Ruan, Shaobo HAN, Siheng XU +1 more | 2023-12-05 |
| 11688604 | Method for using ultra thin ruthenium metal hard mask for etching profile control | Yen-Tien Lu, Angelique Raley | 2023-06-27 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2023-04-04 |
| 11594451 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2023-02-28 |
| 11515203 | Selective deposition of conductive cap for fully-aligned-via (FAV) | Yen-Tien Lu, Xinghua Sun, Angelique Raley | 2022-11-29 |
| D968749 | Food product | Huaizhang Wang, Kuangzheng Ding | 2022-11-08 |
| 11456212 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2022-09-27 |
| 11450562 | Method of bottom-up metallization in a recessed feature | Jodi Grzeskowiak, Nicholas Joy, Jeffrey Smith | 2022-09-20 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | David L. O'Meara, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |
| 10950444 | Metal hard mask layers for processing of microelectronic workpieces | Yen-Tien Lu, Andrew Metz | 2021-03-16 |
| 10923394 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2021-02-16 |
| 10923392 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Robert D. Clark | 2021-02-16 |
| 10886173 | Platform and method of operating for integrated end-to-end fully self-aligned interconnect process | Robert D. Clark, Kandabara Tapily | 2021-01-05 |
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Nicholas Joy, Kaoru Maekawa, Robert D. Clark | 2020-12-08 |
| 10770479 | Three-dimensional device and method of forming the same | Jeffrey Smith, Anton J. deVilliers, Kandabara Tapily, Jodi Grzeskowiak | 2020-09-08 |
| 10700009 | Ruthenium metal feature fill for interconnects | Nicholas Joy, Eric Chih-Fang Liu, David L. O'Meara, David S. H. Rosenthal, Masanobu Igeta +2 more | 2020-06-30 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Kaoru Maekawa, Jeffrey Smith, Nicholas Joy, Gerrit J. Leusink | 2020-03-03 |
| 10541174 | Interconnect structure and method of forming the same | Soo Doo Chae, Jeffrey Smith, Gerrit J. Leusink, Robert D. Clark | 2020-01-21 |
| 10498523 | Multipath clock and data recovery | Jin Wang | 2019-12-03 |