Issued Patents All Time
Showing 1–25 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341009 | Variable hardness amorphous carbon mask | Shihsheng Chang, Andrew Metz, Yun Han, Ya-Ming Chen, Kai-Hung Yu | 2025-06-24 |
| 12265326 | Method for reducing lithography defects and pattern transfer | Angelique Raley, Nihar Mohanty | 2025-04-01 |
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Shihsheng Chang, Ying Trickett, Yun Han, Henan Zhang +5 more | 2025-02-25 |
| 12148624 | Wet etch process and method to control fin height and channel area in a fin field effect transistor (FinFET) | Shan Hu, Henan Zhang, Sangita Kumari, Peter Delia | 2024-11-19 |
| 12100598 | Methods for planarizing a substrate using a combined wet etch and chemical mechanical polishing (CMP) process | Shan Hu, Henan Zhang, Sangita Kumari, Peter Delia | 2024-09-24 |
| 12009211 | Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition | Ya-Ming Chen, Katie Lutker-Lee, Angelique Raley, Stephanie Oyola-Reynoso, Shihsheng Chang | 2024-06-11 |
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Xinghua Sun, Shihsheng Chang, Angelique Raley, Katie Lutker-Lee | 2023-09-12 |
| 11651965 | Method and system for capping of cores for self-aligned multiple patterning | Akiteru Ko | 2023-05-16 |
| 11557479 | Methods for EUV inverse patterning in processing of microelectronic workpieces | Akiteru Ko, Subhadeep Kal, Toshiharu Wada | 2023-01-17 |
| 11424123 | Forming a semiconductor feature using atomic layer etch | Akiteru Ko, Angelique Raley, Henan Zhang, Shan Hu, Subhadeep Kal | 2022-08-23 |
| 11417526 | Multiple patterning processes | David L. O'Meara, Jodi Grzeskowiak, Anton J. deVilliers, Akiteru Ko, Anthony Dip | 2022-08-16 |
| 11395687 | Insertion tool for flip anchor cable system insertion | This Aebi, Daniel Andermatt, Mirko Rocci | 2022-07-26 |
| 11333968 | Method for reducing lithography defects and pattern transfer | Angelique Raley, Nihar Mohanty | 2022-05-17 |
| 11121027 | High aspect ratio via etch using atomic layer deposition protection layer | Yen-Tien Lu, Xinghua Sun, Andrew Metz | 2021-09-14 |
| 10978307 | Deposition process | David L. O'Meara, Richard A. Farrell, Soo Doo Chae | 2021-04-13 |
| 10790154 | Method of line cut by multi-color patterning technique | Akiteru Ko | 2020-09-29 |
| 10734228 | Manufacturing methods to apply stress engineering to self-aligned multi-patterning (SAMP) processes | Akiteru Ko, David L. O'Meara | 2020-08-04 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, David L. O'Meara, David S. H. Rosenthal, Masanobu Igeta +2 more | 2020-06-30 |
| 10453686 | In-situ spacer reshaping for self-aligned multi-patterning methods and systems | Angelique Raley, Akiteru Ko | 2019-10-22 |
| 10170329 | Spacer formation for self-aligned multi-patterning technique | Akiteru Ko | 2019-01-01 |
| 10049892 | Method for processing photoresist materials and structures | Nihar Mohanty, Elliott Franke | 2018-08-14 |
| 9870954 | Simultaneous formation of source/drain openings with different profiles | Srisuda Thitinun, Dai-Lin Wu, Ryan Chia-Jen Chen, Chao-Cheng Chen | 2018-01-16 |
| 9704974 | Process of manufacturing Fin-FET device | Chia-Wei Chang, An-Shen Chang, Ryan Chia-Jen Chen, Chia Tai Lin, Chih-Tang Peng | 2017-07-11 |
| 9470514 | System and method for using laser scan micrometer to measure surface changes on non-concave surfaces | Sean Carl Mitchem, Kerry J. McCubbin | 2016-10-18 |
| 9379220 | FinFET device structure and methods of making same | Yu-Chao Lin, Cheng-Han Wu, Ryan Chia-Jen Chen, Chao-Cheng Chen | 2016-06-28 |