Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334391 | Method for patterning a substrate using photolithography | Angelique Raley, Nicholas Joy | 2025-06-17 |
| 12322597 | Pitch scaling in microfabrication | Angelique Raley | 2025-06-03 |
| 12100591 | Photoactive metal-based hard mask integration | Angelique Raley | 2024-09-24 |
| 12009211 | Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition | Ya-Ming Chen, Eric Chih-Fang Liu, Angelique Raley, Stephanie Oyola-Reynoso, Shihsheng Chang | 2024-06-11 |
| 11978631 | Forming contact holes with controlled local critical dimension uniformity | Junling Sun, Angelique Raley, Andrew Metz | 2024-05-07 |
| 11882776 | In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cells | Angelique Raley, Dina H. Triyoso | 2024-01-23 |
| 11837471 | Methods of patterning small features | Jake Kaminsky, Yu-Hao Tsai, Angelique Raley, Mingmei Wang | 2023-12-05 |
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Xinghua Sun, Shihsheng Chang, Eric Chih-Fang Liu, Angelique Raley | 2023-09-12 |
| 11621164 | Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposes | David L. O'Meara, Angelique Raley | 2023-04-04 |
| 11410852 | Protective layers and methods of formation during plasma etching processes | Angelique Raley | 2022-08-09 |
| 11361993 | Method for inverse via patterning for back end of line dual damascene structures | Angelique Raley | 2022-06-14 |
| 10304725 | Manufacturing methods to protect ULK materials from damage during etch processing to obtain desired features | Xinghua Sun, Takashi Yamamura, Hiroyuki Nagai, Ryuichi Asako | 2019-05-28 |
| 9818610 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Andrew Metz, Yannick Feurprier | 2017-11-14 |
| 9607834 | Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP) | Hiroie Matsumoto, Andrew Metz, Yannick Feurprier | 2017-03-28 |