Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341009 | Variable hardness amorphous carbon mask | Andrew Metz, Yun Han, Ya-Ming Chen, Kai-Hung Yu, Eric Chih-Fang Liu | 2025-06-24 |
| 12266534 | Forming a semiconductor device using a protective layer | Andrew Metz | 2025-04-01 |
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Ying Trickett, Eric Chih-Fang Liu, Yun Han, Henan Zhang +5 more | 2025-02-25 |
| 12040176 | Technologies for high aspect ratio carbon etching with inserted charge dissipation layer | Andrew Metz, Yun Han, Minjoon Park, Ya-Ming Chen | 2024-07-16 |
| 12009211 | Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition | Ya-Ming Chen, Katie Lutker-Lee, Eric Chih-Fang Liu, Angelique Raley, Stephanie Oyola-Reynoso | 2024-06-11 |
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Xinghua Sun, Eric Chih-Fang Liu, Angelique Raley, Katie Lutker-Lee | 2023-09-12 |
| 11651967 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | David L. O'Meara, Andrew Metz, Yun Han | 2023-05-16 |
| 11538692 | Cyclic plasma etching of carbon-containing materials | Yunho Kim, Du Zhang, Mingmei Wang, Andrew Metz | 2022-12-27 |
| 11227774 | Methods and systems for etching silicon cyanide (SiCN) with multi-color selectivity | Andrew Metz | 2022-01-18 |
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | David L. O'Meara, Andrew Metz, Yun Han | 2021-12-07 |
| 10937659 | Method of anisotropically etching adjacent lines with multi-color selectivity | Andrew Metz | 2021-03-02 |