Issued Patents All Time
Showing 1–25 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334391 | Method for patterning a substrate using photolithography | Katie Lutker-Lee, Nicholas Joy | 2025-06-17 |
| 12322597 | Pitch scaling in microfabrication | Katie Lutker-Lee | 2025-06-03 |
| 12308250 | Pre-etch treatment for metal etch | Scott Lefevre | 2025-05-20 |
| 12265326 | Method for reducing lithography defects and pattern transfer | Eric Chih-Fang Liu, Nihar Mohanty | 2025-04-01 |
| 12100591 | Photoactive metal-based hard mask integration | Katie Lutker-Lee | 2024-09-24 |
| 12080599 | Methods for forming self-aligned contacts using spin-on silicon carbide | Junling Sun, Lior Huli, Andrew Metz | 2024-09-03 |
| 12009211 | Method for highly anisotropic etching of titanium oxide spacer using selective top-deposition | Ya-Ming Chen, Katie Lutker-Lee, Eric Chih-Fang Liu, Stephanie Oyola-Reynoso, Shihsheng Chang | 2024-06-11 |
| 11978631 | Forming contact holes with controlled local critical dimension uniformity | Junling Sun, Katie Lutker-Lee, Andrew Metz | 2024-05-07 |
| 11915931 | Extreme ultraviolet lithography patterning method | Choong-Man Lee, Soo Doo Chae, Qiaowei Lou, Toshio Hasegawa, Yoshihiro Kato | 2024-02-27 |
| 11882776 | In-situ encapsulation of metal-insulator-metal (MIM) stacks for resistive random access memory (RERAM) cells | Katie Lutker-Lee, Dina H. Triyoso | 2024-01-23 |
| 11837471 | Methods of patterning small features | Katie Lutker-Lee, Jake Kaminsky, Yu-Hao Tsai, Mingmei Wang | 2023-12-05 |
| 11756790 | Method for patterning a dielectric layer | Yen-Tien Lu, Xinghua Sun, Shihsheng Chang, Eric Chih-Fang Liu, Katie Lutker-Lee | 2023-09-12 |
| 11742241 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Yen-Tien Lu, David L. O'Meara, Jeffrey Smith | 2023-08-29 |
| 11721578 | Split ash processes for via formation to suppress damage to low-K layers | Yen-Tien Lu, Joe Lee | 2023-08-08 |
| 11688604 | Method for using ultra thin ruthenium metal hard mask for etching profile control | Yen-Tien Lu, Kai-Hung Yu | 2023-06-27 |
| 11658038 | Method for dry etching silicon carbide films for resist underlayer applications | Christopher Cole, Qiaowei Lou | 2023-05-23 |
| 11621164 | Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposes | Katie Lutker-Lee, David L. O'Meara | 2023-04-04 |
| 11538691 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Subhadeep Kal, Nihar Mohanty, Aelan Mosden, Scott Lefevre | 2022-12-27 |
| 11515203 | Selective deposition of conductive cap for fully-aligned-via (FAV) | Yen-Tien Lu, Kai-Hung Yu, Xinghua Sun | 2022-11-29 |
| 11495436 | Systems and methods to control critical dimension (CD) shrink ratio through radio frequency (RF) pulsing | Junling Sun, Andrew Metz | 2022-11-08 |
| 11482454 | Methods for forming self-aligned contacts using spin-on silicon carbide | Junling Sun, Lior Huli, Andrew Metz | 2022-10-25 |
| 11424123 | Forming a semiconductor feature using atomic layer etch | Eric Chih-Fang Liu, Akiteru Ko, Henan Zhang, Shan Hu, Subhadeep Kal | 2022-08-23 |
| 11410852 | Protective layers and methods of formation during plasma etching processes | Katie Lutker-Lee | 2022-08-09 |
| 11398379 | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process | Robert D. Clark, Richard A. Farrell, Kandabara Tapily, Sophie Thibaut | 2022-07-26 |
| 11380554 | Gas phase etching system and method | Subhadeep Kal, Nihar Mohanty, Aelan Mosden, Scott Lefevre | 2022-07-05 |