Issued Patents All Time
Showing 26–50 of 56 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11361993 | Method for inverse via patterning for back end of line dual damascene structures | Katie Lutker-Lee | 2022-06-14 |
| 11333968 | Method for reducing lithography defects and pattern transfer | Eric Chih-Fang Liu, Nihar Mohanty | 2022-05-17 |
| 11322364 | Method of patterning a metal film with improved sidewall roughness | Nicholas Joy | 2022-05-03 |
| 11289325 | Radiation of substrates during processing and systems thereof | Michael Edley, Xinghua Sun, Yen-Tien Lu, Henan Zhang, Hiroyuki Suzuki +1 more | 2022-03-29 |
| 11227767 | Critical dimension trimming method designed to minimize line width roughness and line edge roughness | Kal Subhadeep | 2022-01-18 |
| 11164781 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Yen-Tien Lu, David L. O'Meara, Jeffrey Smith | 2021-11-02 |
| 11127594 | Manufacturing methods for mandrel pull from spacers for multi-color patterning | Xinghua Sun, Andrew Metz | 2021-09-21 |
| 11101173 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Robert D. Clark, Jeffrey Smith, Kandabara Tapily, Qiang Zhao | 2021-08-24 |
| 10971372 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Subhadeep Kal, Nihar Mohanty, Aelan Mosden, Scott Lefevre | 2021-04-06 |
| 10964587 | Atomic layer deposition for low-K trench protection during etch | Yen-Tien Lu, David L. O'Meara, Xinghua Sun | 2021-03-30 |
| 10950460 | Method utilizing using post etch pattern encapsulation | Andrew Metz, Cory Wajda, Junling Sun | 2021-03-16 |
| 10916472 | Self-aware and correcting heterogenous platform incorporating integrated semiconductor processing modules and method for using same | Robert D. Clark, Jeffrey Smith, Kandabara Tapily, Qiang Zhao | 2021-02-09 |
| 10867854 | Double plug method for tone inversion patterning | — | 2020-12-15 |
| 10854453 | Method for reducing reactive ion etch lag in low K dielectric etching | Christopher Cole, Andrew Metz | 2020-12-01 |
| 10748769 | Methods and systems for patterning of low aspect ratio stacks | Elliott Franke, Sophie Thibaut | 2020-08-18 |
| 10727057 | Platform and method of operating for integrated end-to-end self-aligned multi-patterning process | Robert D. Clark, Richard A. Farrell, Kandabara Tapily, Sophie Thibaut | 2020-07-28 |
| 10580660 | Gas phase etching system and method | Subhadeep Kal, Nihar Mohanty, Aelan Mosden, Scott Lefevre | 2020-03-03 |
| 10497575 | Method for increasing trench CD in EUV patterning without increasing single line opens or roughness | Jeffrey Shearer | 2019-12-03 |
| 10453686 | In-situ spacer reshaping for self-aligned multi-patterning methods and systems | Eric Chih-Fang Liu, Akiteru Ko | 2019-10-22 |
| 10354873 | Organic mandrel protection process | Akiteru Ko, Sophie Thibaut, Satoru Nakamura, Nihar Mohanty | 2019-07-16 |
| 10049875 | Trim method for patterning during various stages of an integration scheme | Akiteru Ko | 2018-08-14 |
| 9786503 | Method for increasing pattern density in self-aligned patterning schemes without using hard masks | Nihar Mohanty, Akiteru Ko | 2017-10-10 |
| 9748110 | Method and system for selective spacer etch for multi-patterning schemes | Subhadeep Kal, Nihar Mohanty, Aelan Mosden | 2017-08-29 |
| 9673059 | Method for increasing pattern density in self-aligned patterning integration schemes | Akiteru Ko | 2017-06-06 |
| 9443731 | Material processing to achieve sub-10nm patterning | David L. O'Meara, Akiteru Ko, Kiyohito Ito | 2016-09-13 |