Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12272558 | Selective and isotropic etch of silicon over silicon-germanium alloys and dielectrics; via new chemistry and surface modification | Matthew Flaugh, Jonathan Hollin, Subhadeep Kal, Pingshan Luan, Hamed Hajibabaeinajafabadi +1 more | 2025-04-08 |
| 12002683 | Lateral etching of silicon | Hamed Hajibabaeinajafabadi, Pingshan Luan, Sergey Voronin | 2024-06-04 |
| 11837467 | Plasma etching techniques | Pingshan Luan, Christopher Catano | 2023-12-05 |
| 11715643 | Gas phase etch with controllable etch selectivity of metals | Subhadeep Kal, Daisuke Ito, Matthew Flaugh, Yusuke Muraki | 2023-08-01 |
| 11538690 | Plasma etching techniques | Pingshan Luan | 2022-12-27 |
| 11538691 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Subhadeep Kal, Nihar Mohanty, Angelique Raley, Scott Lefevre | 2022-12-27 |
| 11482423 | Plasma etching techniques | Pingshan Luan | 2022-10-25 |
| 11424120 | Plasma etching techniques | Pingshan Luan, Christopher Catano | 2022-08-23 |
| 11380554 | Gas phase etching system and method | Subhadeep Kal, Nihar Mohanty, Angelique Raley, Scott Lefevre | 2022-07-05 |
| 11322350 | Non-plasma etch of titanium-containing material layers with tunable selectivity to alternate metals and dielectrics | Daisuke Ito, Subhadeep Kal, Shinji Irie | 2022-05-03 |
| 11189499 | Atomic layer etch (ALE) of tungsten or other metal layers | Yu-Hao Tsai, Du Zhang, Mingmei Wang, Matthew Flaugh | 2021-11-30 |
| 10971372 | Gas phase etch with controllable etch selectivity of Si-containing arc or silicon oxynitride to different films or masks | Subhadeep Kal, Nihar Mohanty, Angelique Raley, Scott Lefevre | 2021-04-06 |
| 10923356 | Gas phase etch with controllable etch selectivity of silicon-germanium alloys | Subhadeep Kal, Masashi Matsumoto, Daisuke Ito, Yusuke Muraki | 2021-02-16 |
| 10600687 | Process integration techniques using a carbon layer to form self-aligned structures | Kaushik A. Kumar | 2020-03-24 |
| 10580660 | Gas phase etching system and method | Subhadeep Kal, Nihar Mohanty, Angelique Raley, Scott Lefevre | 2020-03-03 |
| 10573564 | Method for fabricating NFET and PFET nanowire devices | Cheryl Pereira, Subhadeep Kal | 2020-02-25 |
| 10290553 | System and method of determining process completion of post heat treatment of a dry etch process | Jacob Frederick Theisen | 2019-05-14 |
| 9984890 | Isotropic silicon and silicon-germanium etching with tunable selectivity | Subhadeep Kal, Kandabara Tapily | 2018-05-29 |
| 9748110 | Method and system for selective spacer etch for multi-patterning schemes | Subhadeep Kal, Angelique Raley, Nihar Mohanty | 2017-08-29 |
| 8809169 | Multi-layer pattern for alternate ALD processes | David L. O'Meara | 2014-08-19 |
| 8673725 | Multilayer sidewall spacer for seam protection of a patterned structure | David L. O'Meara, Anthony Dip, Pao-Hwa Chou, Richard A. Conti | 2014-03-18 |
| 8664102 | Dual sidewall spacer for seam protection of a patterned structure | David L. O'Meara, Anthony Dip, Pao-Hwa Chou, Richard A. Conti | 2014-03-04 |
| 7959970 | System and method of removing chamber residues from a plasma processing system in a dry cleaning process | Marcel Gaudet, Robert J. Soave | 2011-06-14 |
| 7291446 | Method and system for treating a hard mask to improve etch characteristics | Dung Phan | 2007-11-06 |
| 7226868 | Method of etching high aspect ratio features | Sandra Hyland, Minori Kajimoto | 2007-06-05 |