Issued Patents All Time
Showing 1–25 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400872 | Sacrificial capping layer for gate protection | Yun Han, Cheryl Alix, Andrew Metz, Shan Hu, Henan Zhang | 2025-08-26 |
| 11823910 | Systems and methods for improving planarity using selective atomic layer etching (ALE) | Anthony Dip, Masanobu Igeta | 2023-11-21 |
| 11742241 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Yen-Tien Lu, Angelique Raley, Jeffrey Smith | 2023-08-29 |
| 11651967 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, Andrew Metz, Yun Han | 2023-05-16 |
| 11621164 | Method for critical dimension (CD) trim of an organic pattern used for multi-patterning purposes | Katie Lutker-Lee, Angelique Raley | 2023-04-04 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2023-04-04 |
| 11567407 | Method for globally adjusting spacer critical dimension using photo-active self-assembled monolayer | Richard A. Farrell, Hoyoung Kang | 2023-01-31 |
| 11532517 | Localized etch stop layer | Yun Han, Andrew Metz, Xinghua Sun, Kandabara Tapily, Henan Zhang +1 more | 2022-12-20 |
| 11417526 | Multiple patterning processes | Eric Chih-Fang Liu, Jodi Grzeskowiak, Anton J. deVilliers, Akiteru Ko, Anthony Dip | 2022-08-16 |
| 11195723 | Non-atomic layer deposition (ALD) method of forming sidewall passivation layer during high aspect ratio carbon layer etch | Shihsheng Chang, Andrew Metz, Yun Han | 2021-12-07 |
| 11164781 | ALD (atomic layer deposition) liner for via profile control and related applications | Xinghua Sun, Yen-Tien Lu, Angelique Raley, Jeffrey Smith | 2021-11-02 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Nicholas Joy, Gyanaranjan Pattanaik, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |
| 10978307 | Deposition process | Eric Chih-Fang Liu, Richard A. Farrell, Soo Doo Chae | 2021-04-13 |
| 10964587 | Atomic layer deposition for low-K trench protection during etch | Yen-Tien Lu, Angelique Raley, Xinghua Sun | 2021-03-30 |
| 10770294 | Selective atomic layer deposition (ALD) of protective caps to enhance extreme ultra-violet (EUV) etch resistance | Lior Huli, Soo Doo Chae, Wan Jae Park | 2020-09-08 |
| 10734228 | Manufacturing methods to apply stress engineering to self-aligned multi-patterning (SAMP) processes | Eric Chih-Fang Liu, Akiteru Ko | 2020-08-04 |
| 10700009 | Ruthenium metal feature fill for interconnects | Kai-Hung Yu, Nicholas Joy, Eric Chih-Fang Liu, David S. H. Rosenthal, Masanobu Igeta +2 more | 2020-06-30 |
| 10580650 | Method for bottom-up formation of a film in a recessed feature | Kandabara Tapily, Nihar Mohanty | 2020-03-03 |
| 10079151 | Method for bottom-up deposition of a film in a recessed feature | Kandabara Tapily, Kaushik A. Kumar | 2018-09-18 |
| 9899224 | Method of controlling solid phase diffusion of boron dopants to form ultra-shallow doping regions | Steven P. Consiglio, Robert D. Clark | 2018-02-20 |
| 9831099 | Method and apparatus for multi-film deposition and etching in a batch processing system | Anthony Dip | 2017-11-28 |
| 9443731 | Material processing to achieve sub-10nm patterning | Angelique Raley, Akiteru Ko, Kiyohito Ito | 2016-09-13 |
| 9171736 | Spacer material modification to improve K-value and etch properties | Angelique Raley | 2015-10-27 |
| 8809169 | Multi-layer pattern for alternate ALD processes | Aelan Mosden | 2014-08-19 |
| 8785310 | Method of forming conformal metal silicide films | Toshio Hasegawa, Kunihiro Tada, Hideaki Yamasaki, Gerrit J. Leusink | 2014-07-22 |