Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Shihsheng Chang, Ying Trickett, Eric Chih-Fang Liu, Yun Han +5 more | 2025-02-25 |
| 11621190 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Robert D. Clark, Kandabara Tapily +3 more | 2023-04-04 |
| 11171060 | Dual metal contacts with ruthenium metal plugs for semiconductor devices | Hiroaki Niimi | 2021-11-09 |
| 11024535 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, David L. O'Meara, Nicholas Joy, Robert D. Clark, Kandabara Tapily +3 more | 2021-06-01 |