Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12237216 | Method for filling recessed features in semiconductor devices with a low-resistivity metal | Kai-Hung Yu, Shihsheng Chang, Eric Chih-Fang Liu, Yun Han, Henan Zhang +5 more | 2025-02-25 |
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Kai-Hung Yu, Nicholas Joy, Kaoru Maekawa, Robert D. Clark | 2020-12-08 |
| 10008564 | Method of corner rounding and trimming of nanowires by microwave plasma | Kandabara Tapily, Chihiro TAMURA, Cory Wajda, Gerrit J. Leusink, Kaoru Maekawa | 2018-06-26 |