Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249515 | Etching method and etching apparatus | Shigeru Tahara, Jacques Faguet, Kumiko Ono, Nagisa Sato, Remi Dussart +3 more | 2025-03-11 |
| 12131914 | Selective etching with fluorine, oxygen and noble gas containing plasmas | Du Zhang, Hojin Kim, Shigeru Tahara, Mingmei Wang, Jacques Faguet +4 more | 2024-10-29 |
| 11380579 | Method and process using dual memorization layer for multi-color spacer patterning | Hirokazu Aizawa, Akiteru Ko | 2022-07-05 |
| 11315789 | Method and structure for low density silicon oxide for fusion bonding and debonding | Kiyotaka Imai, Hirokazu Aizawa, Hiroshi Maeda, Yuji Mimura, Harunobu Suenaga | 2022-04-26 |
| 11120999 | Plasma etching method | Koichi Yatsuda, Nagisa Sato, Kumiko Ono, Shigeru Tahara, Jacques Faguet +4 more | 2021-09-14 |
| 10978300 | Methods to reduce gouging for core removal processes using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2021-04-13 |
| 10950442 | Methods to reshape spacers for multi-patterning processes using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2021-03-16 |
| 10916428 | Method to transfer patterns to a layer | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2021-02-09 |
| 10886176 | Self-aligned interconnect patterning for back-end-of-line (BEOL) structures including self-aligned via through the underlying interlevel metal layer | Yuki Kikuchi | 2021-01-05 |
| 10861739 | Method of patterning low-k materials using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Akiteru Ko | 2020-12-08 |
| 10861744 | Platform and method of operating for integrated end-to-end CMP-less interconnect process | Ying Trickett, Kai-Hung Yu, Nicholas Joy, Robert D. Clark | 2020-12-08 |
| 10777456 | Semiconductor back end of line (BEOL) interconnect using multiple materials in a fully self-aligned via (FSAV) process | Hirokazu Aizawa | 2020-09-15 |
| 10580691 | Method of integrated circuit fabrication with dual metal power rail | Soo Doo Chae, Jeffrey Smith, Nicholas Joy, Gerrit J. Leusink, Kai-Hung Yu | 2020-03-03 |
| 10217670 | Wrap-around contact integration scheme | Kandabara Tapily, Satoru Nakamura, Soo Doo Chae, Akiteru Ko, Gerrit J. Leusink | 2019-02-26 |
| 10157784 | Integration of a self-forming barrier layer and a ruthenium metal liner in copper metallization | Kai-Hung Yu, Manabu Oie, Cory Wajda, Gerrit J. Leusink, Yuuki Kikuchi +2 more | 2018-12-18 |
| 10008564 | Method of corner rounding and trimming of nanowires by microwave plasma | Kandabara Tapily, Ying Trickett, Chihiro TAMURA, Cory Wajda, Gerrit J. Leusink | 2018-06-26 |
| 9607888 | Integration of ALD barrier layer and CVD Ru liner for void-free Cu filling | Kai-Hung Yu, Toshio Hasegawa, Tadahiro Ishizaka, Manabu Oie, Fumitaka Amano +3 more | 2017-03-28 |
| 9245847 | Method for manufacturing semiconductor device for forming metal element-containing layer on insulating layer in which concave portion is formed, semiconductor device including insulating layer in which concave portion is formed, and semiconductor layer on insulating layer in which concave portion is formed | Kenji Matsumoto, Tatsufumi HAMADA | 2016-01-26 |
| 9121094 | Sputtering method and sputtering apparatus | Hiroyuki Nagai, Tatsuo Hatano, Takashi Sakuma | 2015-09-01 |
| 7902077 | Semiconductor device manufacturing method that recovers damage of the etching target while supplying a predetermined recovery gas | Ryuichi Asako, Yasushi Fujii | 2011-03-08 |
| 6893954 | Method for patterning a semiconductor wafer | — | 2005-05-17 |
| 6890848 | Fabrication process of a semiconductor device | Satohiko Hoshino, Masahito Sugiura, Federica Allegretti | 2005-05-10 |
| 6776874 | Processing method and apparatus for removing oxide film | Yasuo Kobayashi, Kotaro Miyatani | 2004-08-17 |
| 6706334 | Processing method and apparatus for removing oxide film | Yasuo Kobayashi, Kotaro Miyatani | 2004-03-16 |
| 5373145 | Cooking apparatus operated by a single operational key that automatically sets a most suitable cooking mode | Sachiko Endo, Koji Murakami, Teruya Tanaka, Tatsuya Nakagawa | 1994-12-13 |