Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12332568 | Metal oxide resists for EUV patterning and methods for developing the same | Hamed Hajibabaeinajafabadi | 2025-06-17 |
| 12287578 | Cyclic method for reactive development of photoresists | Hamed Hajibabaeinajafabadi, Yu-Hao Tsai, Sergey Voronin | 2025-04-29 |
| 12272559 | Oblique deposition and etch processes | — | 2025-04-08 |
| 11676817 | Method for pitch split patterning using sidewall image transfer | Richard A. Farrell | 2023-06-13 |
| 11651965 | Method and system for capping of cores for self-aligned multiple patterning | Eric Chih-Fang Liu | 2023-05-16 |
| 11626271 | Surface fluorination remediation for aluminium oxide electrostatic chucks | Scott Lefevre | 2023-04-11 |
| 11615958 | Methods to reduce microbridge defects in EUV patterning for microelectronic workpieces | — | 2023-03-28 |
| 11557479 | Methods for EUV inverse patterning in processing of microelectronic workpieces | Eric Chih-Fang Liu, Subhadeep Kal, Toshiharu Wada | 2023-01-17 |
| 11551930 | Methods to reshape spacer profiles in self-aligned multiple patterning | Kazuya Okubo, Hiroyuki Toshima | 2023-01-10 |
| 11537049 | Method of line roughness improvement by plasma selective deposition | Toshiharu Wada, Chia-Yun Hsieh | 2022-12-27 |
| 11515160 | Substrate processing method using multiline patterning | — | 2022-11-29 |
| 11424123 | Forming a semiconductor feature using atomic layer etch | Eric Chih-Fang Liu, Angelique Raley, Henan Zhang, Shan Hu, Subhadeep Kal | 2022-08-23 |
| 11417526 | Multiple patterning processes | David L. O'Meara, Eric Chih-Fang Liu, Jodi Grzeskowiak, Anton J. deVilliers, Anthony Dip | 2022-08-16 |
| 11380579 | Method and process using dual memorization layer for multi-color spacer patterning | Hirokazu Aizawa, Kaoru Maekawa | 2022-07-05 |
| 11372332 | Plasma treatment method to improve photo resist roughness and remove photo resist scum | Wan Jae Park | 2022-06-28 |
| 11049721 | Method and process for forming memory hole patterns | Toshiharu Wada, Anton J. deVilliers | 2021-06-29 |
| 10978300 | Methods to reduce gouging for core removal processes using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa | 2021-04-13 |
| 10950442 | Methods to reshape spacers for multi-patterning processes using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa | 2021-03-16 |
| 10916428 | Method to transfer patterns to a layer | Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa | 2021-02-09 |
| 10861739 | Method of patterning low-k materials using thermal decomposition materials | Yuki Kikuchi, Toshiharu Wada, Kaoru Maekawa | 2020-12-08 |
| 10790154 | Method of line cut by multi-color patterning technique | Eric Chih-Fang Liu | 2020-09-29 |
| 10734228 | Manufacturing methods to apply stress engineering to self-aligned multi-patterning (SAMP) processes | Eric Chih-Fang Liu, David L. O'Meara | 2020-08-04 |
| 10453686 | In-situ spacer reshaping for self-aligned multi-patterning methods and systems | Eric Chih-Fang Liu, Angelique Raley | 2019-10-22 |
| 10354873 | Organic mandrel protection process | Angelique Raley, Sophie Thibaut, Satoru Nakamura, Nihar Mohanty | 2019-07-16 |
| 10290506 | Method for etching high-K dielectric using pulsed bias power | Alok Ranjan | 2019-05-14 |