Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027353 | Substrate processing method and apparatus | Shota ISHIBASHI, Hiroyuki Iwashita, Tatsuo Hirasawa | 2024-07-02 |
| 12014911 | Sputtering apparatus | Shota ISHIBASHI, Tatsuo Hirasawa, Hiroyuki Iwashita | 2024-06-18 |
| 11851750 | Apparatus and method for performing sputtering process | Masato SHINADA, Einstein Noel Abarra, Shota ISHIBASHI | 2023-12-26 |
| 11742190 | Sputtering apparatus and film forming method | Einstein Noel Abarra, Shota ISHIBASHI, Hiroyuki Iwashita, Tatsuo Hirasawa, Masato SHINADA | 2023-08-29 |
| 11705315 | Sputtering apparatus and sputtering method | Shota ISHIBASHI | 2023-07-18 |
| 11664207 | Film-forming apparatus, film-forming system, and film-forming method | Masato SHINADA | 2023-05-30 |
| 11551930 | Methods to reshape spacer profiles in self-aligned multiple patterning | Akiteru Ko, Kazuya Okubo | 2023-01-10 |
| 11512388 | Film forming apparatus and film forming method | Masato SHINADA | 2022-11-29 |
| 11495446 | Film formation device and film formation method | Masato SHINADA, Einstein Noel Abarra | 2022-11-08 |
| 11479848 | Film forming apparatus and method | Shota ISHIBASHI, Hiroyuki Iwashita, Tatsuo Hirasawa | 2022-10-25 |
| 11469106 | Hard mask and hard mask forming method | Shinji Furukawa | 2022-10-11 |
| 11410837 | Film-forming device | Tatsuo Hatano, Tetsuya Miyashita, Shinji Furukawa, Junichi Takei | 2022-08-09 |
| 11158492 | Film forming apparatus and film forming method | Hiroyuki Iwashita, Tatsuo Hirasawa | 2021-10-26 |
| 10189230 | Method for forming copper film | Atsushi Shimada, Tatsuo Hirasawa, Tatsuo Hatano, Shinji Furukawa | 2019-01-29 |
| 10068798 | Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrate | Tatsuo Hatano, Shinji Furukawa, Naoki Watanabe, Naoyuki Suzuki | 2018-09-04 |
| 9064690 | Method for forming Cu wiring | Tadahiro Ishizaka, Atsushi Gomi, Kenji Suzuki, Tatsuo Hatano, Yasushi Mizusawa | 2015-06-23 |
| 8859422 | Method of forming copper wiring and method and system for forming copper film | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma +5 more | 2014-10-14 |
| 8617363 | Magnetron sputtering apparatus | Shigeru Mizuno | 2013-12-31 |
| 8399353 | Methods of forming copper wiring and copper film, and film forming system | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma +4 more | 2013-03-19 |
| 8384207 | Semiconductor integrated circuit device having insulated through wires | Natsuo Nakamura | 2013-02-26 |
| 7594805 | Adhesive injection apparatus | Nobuaki Miyakawa, Natsuo Nakamura, Takahiro Kimura | 2009-09-29 |
| 7308395 | Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group | Hisashi Kaneko, Motoya Okazaki | 2007-12-11 |