Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12027353 | Substrate processing method and apparatus | Shota ISHIBASHI, Hiroyuki Toshima, Hiroyuki Iwashita | 2024-07-02 |
| 12014911 | Sputtering apparatus | Shota ISHIBASHI, Hiroyuki Toshima, Hiroyuki Iwashita | 2024-06-18 |
| 11742190 | Sputtering apparatus and film forming method | Einstein Noel Abarra, Hiroyuki Toshima, Shota ISHIBASHI, Hiroyuki Iwashita, Masato SHINADA | 2023-08-29 |
| 11479848 | Film forming apparatus and method | Shota ISHIBASHI, Hiroyuki Toshima, Hiroyuki Iwashita | 2022-10-25 |
| 11158492 | Film forming apparatus and film forming method | Hiroyuki Toshima, Hiroyuki Iwashita | 2021-10-26 |
| 10309005 | Deposition device and deposition method | Yasuhiko Kojima, Hiroshi Sone, Atsushi Gomi, Kanto Nakamura, Toru Kitada +6 more | 2019-06-04 |
| 10189230 | Method for forming copper film | Hiroyuki Toshima, Atsushi Shimada, Tatsuo Hatano, Shinji Furukawa | 2019-01-29 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Takashi Sakuma, Chiaki Yasumuro, Tadahiro Ishizaka +1 more | 2016-08-02 |
| 9406558 | Cu wiring fabrication method and storage medium | Tadahiro Ishizaka, Takashi Sakuma, Osamu Yokoyama | 2016-08-02 |
| 9253862 | Plasma processing method and plasma processing apparatus | Osamu Yokoyama, Chiaki Yasumuro, Toshiaki Fujisato, Ryota Yoshida, Takashi Sakuma +1 more | 2016-02-02 |