Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10309005 | Deposition device and deposition method | Yasuhiko Kojima, Hiroshi Sone, Atsushi Gomi, Kanto Nakamura, Toru Kitada +6 more | 2019-06-04 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Takashi Sakuma, Tatsuo Hirasawa, Tadahiro Ishizaka +1 more | 2016-08-02 |
| 9253862 | Plasma processing method and plasma processing apparatus | Tatsuo Hirasawa, Osamu Yokoyama, Toshiaki Fujisato, Ryota Yoshida, Takashi Sakuma +1 more | 2016-02-02 |
| 8992686 | Mounting table structure, film forming apparatus and raw material recovery method | Atsushi Gomi, Yasushi Mizusawa, Tatsuo Hatano, Masamichi Hara, Kaoru Yamamoto +1 more | 2015-03-31 |
| 8859422 | Method of forming copper wiring and method and system for forming copper film | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma +5 more | 2014-10-14 |
| 8408025 | Raw material recovery method and trapping mechanism for recovering raw material | Atsushi Gomi, Yasushi Mizusawa, Tatsuo Hatano, Masamichi Hara, Kaoru Yamamoto | 2013-04-02 |
| 8399353 | Methods of forming copper wiring and copper film, and film forming system | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma +4 more | 2013-03-19 |