Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11205599 | Evaluation method of silicon epitaxial wafer | — | 2021-12-21 |
| 11175231 | Method for evaluating carbon concentration | — | 2021-11-16 |
| 10734220 | Method for manufacturing silicon epitaxial wafer and method for manufacturing semiconductor device | — | 2020-08-04 |
| 10643908 | Manufacturing method and evaluation method of silicon epitaxial wafer | — | 2020-05-05 |
| 9976217 | Film forming method using reversible decomposition reaction | Atsushi Gomi, Tatsuo Hatano, Masamichi Hara, Kaoru Yamamoto, Satoshi Taga | 2018-05-22 |
| 9896761 | Trap assembly in film forming apparatus | Masamichi Hara, Kaoru Yamamoto | 2018-02-20 |
| 9576850 | Method for manufacturing semiconductor device | Tadahiro Ishizaka, Atsushi Gomi, Kenji Suzuki, Tatsuo Hatano | 2017-02-21 |
| 9062374 | Method for film formation, apparatus for film formation, and computer-readable recording medium | Masamichi Hara, Satoshi Taga, Atsushi Gomi, Tatsuo Hatano | 2015-06-23 |
| 9064690 | Method for forming Cu wiring | Tadahiro Ishizaka, Atsushi Gomi, Kenji Suzuki, Tatsuo Hatano, Hiroyuki Toshima | 2015-06-23 |
| 8999841 | Semiconductor device manufacturing method | Tadahiro Ishizaka, Atsushi Gomi, Kenzi Suzuki, Tatsuo Hatano | 2015-04-07 |
| 8992686 | Mounting table structure, film forming apparatus and raw material recovery method | Atsushi Gomi, Tatsuo Hatano, Masamichi Hara, Kaoru Yamamoto, Satoshi Taga +1 more | 2015-03-31 |
| 8962352 | Method for calculating warpage of bonded SOI wafer and method for manufacturing bonded SOI wafer | Isao Yokokawa, Hiroji Aga | 2015-02-24 |
| 8859422 | Method of forming copper wiring and method and system for forming copper film | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma +5 more | 2014-10-14 |
| 8440563 | Film forming method and processing system | Kenji Matsumoto | 2013-05-14 |
| 8408025 | Raw material recovery method and trapping mechanism for recovering raw material | Atsushi Gomi, Tatsuo Hatano, Masamichi Hara, Kaoru Yamamoto, Chiaki Yasumuro | 2013-04-02 |
| 8399353 | Methods of forming copper wiring and copper film, and film forming system | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Takashi Sakuma +4 more | 2013-03-19 |
| 8372739 | Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication | Tadahiro Ishizaka, Satohiko Hoshino, Kuzuhiro Hamamoto, Shigeru Mizuno | 2013-02-12 |
| 8277889 | Film formation method and film formation apparatus | Atsushi Gomi, Tatsuo Hatano, Masamichi Hara, Osamu Yokoyama, Satoshi Taga | 2012-10-02 |
| 8273409 | Method for film formation, apparatus for film formation, and computer-readable recording medium | Masamichi Hara, Satoshi Taga, Atsushi Gomi, Tatsuo Hatano | 2012-09-25 |
| 8268078 | Method and apparatus for reducing particle contamination in a deposition system | Kenji Suzuki, Atsushi Gomi, Masamichi Hara | 2012-09-18 |
| 8043871 | Method for forming oxide film on silicon wafer | Tsuyoshi Ohtsuki, Satoshi Tobe | 2011-10-25 |
| 8034406 | Integrated substrate processing in a vacuum processing tool | Tadahiro Ishizaka, Masamichi Hara | 2011-10-11 |
| 8029873 | Film deposition method and film deposition apparatus of metal film | Taro Ikeda, Tatsuo Hatano, Osamu Yokoyama, Takashi Sakuma | 2011-10-04 |
| 8026176 | Film forming method, plasma film forming apparatus and storage medium | Takashi Sakuma, Taro Ikeda, Osamu Yokoyama, Tsukasa Matsuda, Tatsuo Hatano | 2011-09-27 |
| 7959985 | Method of integrating PEALD Ta-containing films into Cu metallization | Tadahiro Ishizaka, Tsukasa Matsuda, Masamichi Hara, Jacques Faguet | 2011-06-14 |