Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347676 | Substrate processing method and substrate processing system | Yuichiro WAGATSUMA, Masahisa Watanabe, Mayuko NAKAMURA, Osamu Yokoyama, Kwangpyo Choi | 2025-07-01 |
| 12161989 | Cobalt ion adsorption material and method for producing same | Takeshi Izumi, Makoto Komatsu, Hidenori Ishioka, Takafumi Tanaka, Nobuyuki Hashimoto +2 more | 2024-12-10 |
| 11993841 | Substrate processing method and substrate processing apparatus | Masato Araki, Kohichi Satoh, Tadahiro Ishizaka | 2024-05-28 |
| 11890610 | Cobalt ion adsorbent, method for producing same and treatment apparatus for cobalt ion-containing liquid | Makoto Komatsu, Takeshi Izumi, Nobuyuki Hashimoto, Toshimasa Seki, Takafumi Tanaka +1 more | 2024-02-06 |
| 11626290 | Method, device, and system for etching silicon oxide film | Osamu Yokoyama, Kwangpyo Choi, Kazuki Hashimoto, Rio Shimizu, Takashi Kobayashi +1 more | 2023-04-11 |
| 11471855 | Adsorption method for at least one of cesium and strontium employing silicotitanate having sitinakite structure | Yoju Shimizu, Hajime Funakoshi, Keisuke Tokunaga, Shigeru Hirano, Makoto Komatsu +1 more | 2022-10-18 |
| 11446631 | Alkaline earth metal ion adsorbent, and production method of the same, and alkaline earth metal ion-containing liquid treatment apparatus | Makoto Komatsu, Takeshi Izumi, Takayasu Tanaka, Takafumi Tanaka, Hidenori Ishioka +5 more | 2022-09-20 |
| 11409256 | Information processing device, information processing method and non-transitory computer-readable storage medium for synchronizing edited content of control programs | Kenjiro Nagao, Chieko Sato, Naoto Hasegawa | 2022-08-09 |
| 11400432 | Silicotitanate molded body, production method thereof, adsorbent for cesium and/or strontium comprising silicotitanate molded body, and decontamination method for radioactive waste solution by using adsorbent | Makoto Komatsu, Takeshi Izumi, Shinsuke Miyabe, Takeshi Sakamoto, Eiji Noguchi +1 more | 2022-08-02 |
| 11213799 | Adsorbent for radioactive antimony, radioactive iodine and radioactive ruthenium, and treatment method of radioactive waste water using the adsorbent | Makoto Komatsu, Takeshi Izumi, Shinsuke Miyabe, Yutaka Kinose, Kiyoshi Satou +4 more | 2022-01-04 |
| 11110430 | Treatment method of radioactive iodine-containing fluid | Makoto Komatsu, Takeshi Izumi, Keisuke Tokunaga, Shigeru Hirano | 2021-09-07 |
| 10705500 | Support device, method, and recording medium for simplifying control program changing operation | Takashi Unno | 2020-07-07 |
| 10449510 | Agent for adsorption of ruthenium from aqueous solution and method for adsorption of ruthenium from aqueous solution | Tadahito Nakashima, Hyun-Joong Kim, Makoto Komatsu, Takeshi Izumi | 2019-10-22 |
| 10388419 | Adsorbent for adsorbing iodine compounds and/or antimony, method for preparing said adsorbent, and method and apparatus for treating radioactive waste liquid by using said absorbent | Makoto Komatsu, Takeshi Izumi, Tomohiko Ito, Toru Shibuya | 2019-08-20 |
| 10249130 | Game machine provided with lottery mechanism | Ryu Sasaki, Kensaku Yoshida, Yoshihiro Ando | 2019-04-02 |
| 10242878 | Substrate processing method and recording medium | Tomonari Urano, Kyohei NOGUCHI, Osamu Yokoyama, Takashi Kobayashi, Satoshi Wakabayashi | 2019-03-26 |
| 10096548 | Method of manufacturing Cu wiring | Kenji Matsumoto, Tadahiro Ishizaka, Peng Chang, Osamu Yokoyama, Hiroyuki Nagai | 2018-10-09 |
| 9984892 | Oxide film removing method, oxide film removing apparatus, contact forming method, and contact forming system | Takashi Kobayashi, Seishi Murakami, Masahiko Tomita, Takamichi Kikuchi, Akitaka Shimizu +2 more | 2018-05-29 |
| 9425093 | Copper wiring forming method, film forming system, and storage medium | Tadahiro Ishizaka, Osamu Yokoyama, Kai-Hung Yu | 2016-08-23 |
| 9406557 | Copper wiring forming method with Ru liner and Cu alloy fill | Osamu Yokoyama, Cheonsoo Han, Chiaki Yasumuro, Tatsuo Hirasawa, Tadahiro Ishizaka +1 more | 2016-08-02 |
| 9406558 | Cu wiring fabrication method and storage medium | Tadahiro Ishizaka, Tatsuo Hirasawa, Osamu Yokoyama | 2016-08-02 |
| 9362166 | Method of forming copper wiring | Tadahiro Ishizaka, Osamu Yokoyama, Kenji Matsumoto, Peng Chang, Hiroyuki Nagai | 2016-06-07 |
| 9253862 | Plasma processing method and plasma processing apparatus | Tatsuo Hirasawa, Osamu Yokoyama, Chiaki Yasumuro, Toshiaki Fujisato, Ryota Yoshida +1 more | 2016-02-02 |
| 9121094 | Sputtering method and sputtering apparatus | Kaoru Maekawa, Hiroyuki Nagai, Tatsuo Hatano | 2015-09-01 |
| 8859422 | Method of forming copper wiring and method and system for forming copper film | Tadahiro Ishizaka, Atsushi Gomi, Takara Kato, Osamu Yokoyama, Chiaki Yasumuro +5 more | 2014-10-14 |