Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8859422 | Method of forming copper wiring and method and system for forming copper film | Tadahiro Ishizaka, Atsushi Gomi, Osamu Yokoyama, Takashi Sakuma, Chiaki Yasumuro +5 more | 2014-10-14 |
| 8399353 | Methods of forming copper wiring and copper film, and film forming system | Tadahiro Ishizaka, Atsushi Gomi, Osamu Yokoyama, Takashi Sakuma, Chiaki Yasumuro +4 more | 2013-03-19 |