Issued Patents All Time
Showing 1–25 of 85 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8456186 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method | Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui +2 more | 2013-06-04 |
| 8232197 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed | Makoto Honda, Kaori Yomogihara, Kazuhiro Murakami, Masanori Numano, Takahito Nagamatsu +3 more | 2012-07-31 |
| 7996813 | Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program | Masaaki Hatano, Motoya Okazaki, Junichi Wada, Takeshi Nishioka, Takeshi Fujimaki +3 more | 2011-08-09 |
| 7921401 | Stress analysis method, wiring structure design method, program, and semiconductor device production method | Sachiyo Ito, Masahiko Hasunuma | 2011-04-05 |
| 7675183 | Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device | Hiroshi Toyoda, Mitsuhiro Nakao, Masahiko Hasunuma, Atsuko Sakata, Toshiaki Komukai | 2010-03-09 |
| 7667332 | Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program product | Masaaki Hatano, Motoya Okazaki, Junichi Wada, Takeshi Nishioka, Takeshi Fujimaki +3 more | 2010-02-23 |
| 7635646 | Method for fabricating semiconductor device | Seiichi Omoto, Masahiko Hasunuma | 2009-12-22 |
| 7608537 | Method for fabricating semiconductor device | Mie Matsuo | 2009-10-27 |
| 7605076 | Method of manufacturing a semiconductor device from which damage layers and native oxide films in connection holes have been removed | Makoto Honda, Kaori Yomogihara, Kazuhiro Murakami, Masanori Numano, Takahito Nagamatsu +3 more | 2009-10-20 |
| 7601638 | Interconnect metallization method having thermally treated copper plate film with reduced micro-voids | Masahiko Hasunuma, Hiroshi Toyoda | 2009-10-13 |
| 7575664 | Plating method | Tetsuo Matsuda, Katsuya Okumura | 2009-08-18 |
| 7554762 | Recording disk drive having shroud | Masaya Suwa, Yoshiharu Matsuda, Keishi Shimizu | 2009-06-30 |
| 7531876 | Semiconductor device having power semiconductor elements | Ichiro Omura, Kenji Takahashi, Chiaki Takubo, Hideo Aoki, Hideo Numata +5 more | 2009-05-12 |
| 7521352 | Method for manufacturing a semiconductor device | Hideo Shinomiya, Jun Hirota, Mie Matsuo | 2009-04-21 |
| 7495866 | Recording disk drive capable of suppressing vibration of flexible printed circuit board | Mitsuhiro Izumi, Mitsuaki Yoshida, Tsuneyori Ino, Yukihiro Komura, Shinji Fujimoto +1 more | 2009-02-24 |
| 7453046 | Recording disk drive capable of suppressing vibration of flexible printed circuit board | Mitsuhiro Izumi, Mitsuaki Yoshida, Tsuneyori Ino, Yukihiro Komura, Shinji Fujimoto +1 more | 2008-11-18 |
| 7414815 | Magnetic head actuator with centered deviation | Shinji Fujimoto, Masato Shibuya, Tsuneyori Ino, Yukihiro Komura, Mitsuhiro Izumi +1 more | 2008-08-19 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2008-06-17 |
| 7336448 | Magnetic head actuator with equalized deviation | Shinji Fujimoto, Masato Shibuya, Tsuneyori Ino, Yukihiro Komura, Mitsuhiro Izumi +1 more | 2008-02-26 |
| 7314827 | Method of manufacturing semiconductor device | Hiroshi Toyoda, Sachiyo Ito, Masahiko Hasunuma | 2008-01-01 |
| 7308395 | Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group | Motoya Okazaki, Hiroyuki Toshima | 2007-12-11 |
| 7242206 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method | Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui +2 more | 2007-07-10 |
| 7238919 | Heating element movement bonding method for semiconductor components | Mie Matsuo, Hirokazu Ezawa | 2007-07-03 |
| 7232763 | Method of manufacturing semiconductor device | Mitsuhiro Omura, Makiko Katano, Shoko Ito, Takaya Matsushita | 2007-06-19 |
| 7214305 | Method of manufacturing electronic device | Tetsuo Matsuda | 2007-05-08 |