Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011609 | Method of manufacturing a semiconductor device | Kenya Kobayashi, Yosuke Himori, Toshifumi Nishiguchi | 2021-05-18 |
| 9947751 | Semiconductor device and method of manufacturing the same | Kenya Kobayashi, Yosuke Himori, Toshifumi Nishiguchi | 2018-04-17 |
| 8810032 | Semiconductor device and method for manufacturing of same | Tomomi Imamura, Yoshinosuke Nishijo | 2014-08-19 |
| 8431992 | Semiconductor device including first and second semiconductor regions with increasing impurity concentrations from a substrate surface | Kenichi Tokano, Wataru Saito | 2013-04-30 |
| 8415247 | Semiconductor device and method for manufacturing of same | Tomomi Imamura, Yoshinosuke Nishijo | 2013-04-09 |
| 8067310 | Semiconductor device and method for manufacturing of same | Tomomi Imamura, Yoshinosuke Nishijo | 2011-11-29 |
| 7936015 | Semiconductor device having trenches filled with a semiconductor having an impurity concentration gradient | Kenichi Tokano, Wataru Saito | 2011-05-03 |
| 7898031 | Semiconductor device with tapered trenches and impurity concentration gradients | Kenichi Tokano, Wataru Saito | 2011-03-01 |
| 7595530 | Power semiconductor device with epitaxially-filled trenches | Kenichi Tokano, Wataru Saito | 2009-09-29 |
| 7575664 | Plating method | Hisashi Kaneko, Katsuya Okumura | 2009-08-18 |
| 7486663 | Remote access server wherein the number of logical link resources is set higher than the number of physical link resources | Masayuki Yamada, Kazuhiko Azuma, Toshikazu Maruyama | 2009-02-03 |
| 7420245 | Semiconductor device and method of manufacturing the same | Atsuko Yamashita, Hideki Okumura, Masanobu Tsuchitani | 2008-09-02 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2008-06-17 |
| 7214305 | Method of manufacturing electronic device | Hisashi Kaneko | 2007-05-08 |
| 6998342 | Electronic device manufacturing method | Hiroshi Toyoda, Hisashi Kaneko | 2006-02-14 |
| 6913681 | Plating method and plating apparatus | Hisashi Kaneko, Katsuya Okumura | 2005-07-05 |
| 6897143 | Method of manufacturing semiconductor device including two-step polishing operation for cap metal | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Dai Fukushima, Hisashi Kaneko | 2005-05-24 |
| 6787827 | Semiconductor device and method for manufacturing the same | Seiji Inumiya, Katsuhiko Hieda, Yoshio Ozawa | 2004-09-07 |
| 6767437 | Electroplating apparatus and electroplating method | Hisashi Kaneko, Koji Mishima, Natsuki Makino, Junji Kunisawa | 2004-07-27 |
| 6764585 | Electronic device manufacturing method | Hiroshi Toyoda, Hisashi Kaneko | 2004-07-20 |
| 6750143 | Method for forming a plating film, and device for forming the same | Tadashi Iijima | 2004-06-15 |
| 6746589 | Plating method and plating apparatus | Koji Mishima, Hiroaki Inoue, Natsuki Makino, Junji Kunisawa, Kenji Nakamura +2 more | 2004-06-08 |
| 6638411 | Method and apparatus for plating substrate with copper | Koji Mishima, Mizuki Nagai, Ryoichi Kimizuka, Hisashi Kaneko | 2003-10-28 |
| 6632335 | Plating apparatus | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2003-10-14 |
| 6632476 | Substrate processing method and substrate processing apparatus | Hiroko Nakamura, Hisashi Kaneko | 2003-10-14 |