Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Hiroyuki Yano, Gaku Minamihaba, Dai Fukushima, Hisashi Kaneko | 2003-08-26 |
| 6579785 | Method of making multi-level wiring in a semiconductor device | Hiroshi Toyoda, Hisashi Kaneko, Hideaki Hirabayashi | 2003-06-17 |
| 6563308 | Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium | Osamu Nagano, Yuichiro Yamazaki, Motosuke Miyoshi, Hisashi Kaneko | 2003-05-13 |
| 6518177 | Method of manufacturing a semiconductor device | Takashi Kawanoue, Junichi Wada, Hisashi Kaneko | 2003-02-11 |
| 6403481 | Film formation method | Hisashi Kaneko | 2002-06-11 |
| 6403997 | Method for manufacturing semiconductor devices | Seiji Inumiya, Katsuhiko Hieda, Yoshio Ozawa | 2002-06-11 |
| 6375823 | Plating method and plating apparatus | Hisashi Kaneko, Katsuya Okumura | 2002-04-23 |
| 6368951 | Semiconductor device manufacturing method and semiconductor device | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tadashi Iijima, Hisashi Kaneko +5 more | 2002-04-09 |
| 6348402 | Method of manufacturing a copper interconnect | Takashi Kawanoue, Hisashi Kaneko, Tadashi Iijima | 2002-02-19 |
| 6342444 | Method of forming diffusion barrier for copper interconnects | Kazuyuki Higashi, Noriaki Matsunaga, Hiroshi Toyoda, Akihiro Kajita, Hisashi Kaneko | 2002-01-29 |
| 6333215 | Method for manufacturing a semiconductor device | Nobuo Hayasaka | 2001-12-25 |
| 6291891 | Semiconductor device manufacturing method and semiconductor device | Kazuyuki Higashi, Noriaki Matsunaga, Akihiro Kajita, Tadashi Iijima, Hisashi Kaneko +5 more | 2001-09-18 |
| 6251763 | Semiconductor device and method for manufacturing same | Seiji Inumiya, Katsuhiko Hieda, Yoshio Ozawa | 2001-06-26 |
| 6229211 | Semiconductor device and method of manufacturing the same | Takashi Kawanoue, Junichi Wada, Hisashi Kaneko | 2001-05-08 |
| 6227658 | Apparatus and method for forming thin film using ink-jet mechanism | Maria Ronay | 2001-05-08 |
| 6150270 | Method for forming barrier layer for copper metallization | Tadashi Iijima, Hisashi Kaneko | 2000-11-21 |
| 5998100 | Fabrication process using a multi-layer antireflective layer | Tsukasa Azuma, Tokuhisa Ohiwa, David M. Dobuzinsky, Katsuya Okumura | 1999-12-07 |
| 5958630 | Phase shifting mask and method of manufacturing the same | Koji Hashimoto | 1999-09-28 |
| 5759746 | Fabrication process using a thin resist | Tsukasa Azuma, Tokuhisa Ohiwa, David M. Dobuzinsky, Katsuya Okumura | 1998-06-02 |
| 5679610 | Method of planarizing a semiconductor workpiece surface | Katsuya Okumura | 1997-10-21 |
| 5658389 | Thin film forming method and apparatus | Haruo Okano, Tokuhisa Ohiwa | 1997-08-19 |
| 5563105 | PECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming element | David M. Dobuzinsky, Son V. Nguyen, James G. Ryan, Michael J. Shapiro | 1996-10-08 |
| 5413967 | Method of manufacturing semiconductor devices | Haruo Okano | 1995-05-09 |
| 5286523 | Method of processing substrates and substrate processing apparatus | Yuuichi Mikata, Akimichi Yonekura | 1994-02-15 |
| 5132756 | Method of manufacturing semiconductor devices | — | 1992-07-21 |