Issued Patents All Time
Showing 1–25 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8456186 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method | Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui +2 more | 2013-06-04 |
| 8283755 | Multichip semiconductor device, chip therefor and method of formation thereof | Katsuya Okumura, Keiichi Sasaki, Mie Matsuo | 2012-10-09 |
| 8174093 | Multichip semiconductor device, chip therefor and method of formation thereof | Katsuya Okumura, Keiichi Sasaki, Mie Matsuo | 2012-05-08 |
| 7829975 | Multichip semiconductor device, chip therefor and method of formation thereof | Katsuya Okumura, Keiichi Sasaki, Mie Matsuo | 2010-11-09 |
| 7387717 | Method of performing electrolytic treatment on a conductive layer of a substrate | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2008-06-17 |
| 7335517 | Multichip semiconductor device, chip therefor and method of formation thereof | Katsuya Okumura, Keiichi Sasaki, Mie Matsuo | 2008-02-26 |
| 7242206 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method | Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui +2 more | 2007-07-10 |
| 7091733 | Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method | Kiyoshi Takekoshi, Hisatomi Hosaka, Junichi Hagihara, Kunihiko Hatsushika, Takamasa Usui +2 more | 2006-08-15 |
| 7049223 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method | Keiichi Sasaki, Manabu Kimura, Yoshimi Hisatsune | 2006-05-23 |
| 7032307 | Method for fabricating a probe pin for testing electrical characteristics of an apparatus | Noriaki Matsunaga, Hideki Shibata | 2006-04-25 |
| 6977228 | Semiconductor device using damascene technique and manufacturing method therefor | Yusuke Kohyama, Katsuya Okumura | 2005-12-20 |
| 6946387 | Semiconductor device and method for manufacturing the same | Junichi Wada, Atsuko Sakata, Tomio Katata, Takamasa Usui, Masahiko Hasunuma +3 more | 2005-09-20 |
| 6933205 | Integrated circuit device and method of manufacturing the same | Mie Matsuo, Noriaki Matsunaga, Katsuya Okumura | 2005-08-23 |
| 6933216 | Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same | Atsuko Sakata, Keiichi Sasaki, Katsuya Okumura, Hirotaka Nishino | 2005-08-23 |
| 6846750 | High precision pattern forming method of manufacturing a semiconductor device | Tokuhisa Ohiwa, Shoji Seta, Katsuya Okumura, Akihiro Kojima, Junko Ohuchi +3 more | 2005-01-25 |
| 6828684 | Semiconductor device and method of manufacturing the same | Hiroshi Ikegami, Rempei Nakata, Takashi Yoda, Yoshimi Hisatsune | 2004-12-07 |
| 6809421 | Multichip semiconductor device, chip therefor and method of formation thereof | Katsuya Okumura, Keiichi Sasaki, Mie Matsuo | 2004-10-26 |
| 6784680 | Contact probe with guide unit and fabrication method thereof | Tsuyoshi Haga, Katsuya Okumura, Hideki Shibata, Noriaki Matsunaga | 2004-08-31 |
| 6746969 | Method of manufacturing semiconductor device | Miyoko Shimada, Hideshi Miyajima, Rempei Nakata, Hideto Matsuyama, Katsuya Okumura +1 more | 2004-06-08 |
| 6737363 | Method of manufacturing semiconductor device | Hideshi Miyajima, Nobuhide Yamada, Nobuyuki Kurashima | 2004-05-18 |
| 6730447 | Manufacturing system in electronic devices | Shinichi Ito, Tatsuhiko Higashiki, Hiroshi Ikegami | 2004-05-04 |
| 6724208 | Probe pin for testing electrical characteristics of apparatus, probe card using probe pins | Noriaki Matsunaga, Hideki Shibata | 2004-04-20 |
| 6720522 | Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining | Hiroshi Ikegami | 2004-04-13 |
| 6717251 | Stacked type semiconductor device | Mie Matsuo, Tsunetoshi Arikado, Hidemi Ishiuchi, Koji Sakui, Chiaki Takubo | 2004-04-06 |
| 6709966 | Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device | Yoshimi Hisatsune, Keiichi Sasaki, Hiroshi Ikegami, Mie Matsuo, Katsuya Okumura | 2004-03-23 |