Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7049223 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method | Keiichi Sasaki, Manabu Kimura, Nobuo Hayasaka | 2006-05-23 |
| 6828684 | Semiconductor device and method of manufacturing the same | Hiroshi Ikegami, Rempei Nakata, Takashi Yoda, Nobuo Hayasaka | 2004-12-07 |
| 6709966 | Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device | Keiichi Sasaki, Hiroshi Ikegami, Mie Matsuo, Nobuo Hayasaka, Katsuya Okumura | 2004-03-23 |
| 6657306 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method | Keiichi Sasaki, Manabu Kimura, Nobuo Hayasaka | 2003-12-02 |
| 6566261 | Semiconductor device and method of manufacturing the same | Hiroshi Ikegami, Rempei Nakata, Takashi Yoda, Nobuo Hayasaka | 2003-05-20 |