Issued Patents All Time
Showing 26–50 of 71 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6673704 | Semiconductor device and method of manufacturing the same | Junichi Wada, Atsuko Sakata, Tomio Katata, Takamasa Usui, Masahiko Hasunuma +3 more | 2004-01-06 |
| 6657306 | Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method | Keiichi Sasaki, Manabu Kimura, Yoshimi Hisatsune | 2003-12-02 |
| 6632335 | Plating apparatus | Junji Kunisawa, Mitsuko Odagaki, Natsuki Makino, Koji Mishima, Kenji Nakamura +7 more | 2003-10-14 |
| 6614106 | Stacked circuit device and method for evaluating an integrated circuit substrate using the stacked circuit device | Mie Matsuo | 2003-09-02 |
| 6608356 | Semiconductor device using damascene technique and manufacturing method therefor | Yusuke Kohyama, Katsuya Okumura | 2003-08-19 |
| 6566632 | Hot plate and semiconductor device manufacturing method using the same | Tomio Katata, Katsuya Okumura | 2003-05-20 |
| 6566261 | Semiconductor device and method of manufacturing the same | Hiroshi Ikegami, Rempei Nakata, Takashi Yoda, Yoshimi Hisatsune | 2003-05-20 |
| 6538323 | Semiconductor device having an electrode structure comprising a conductive fine particle film | Atsuko Sakata, Keiichi Sasaki, Katsuya Okumura, Hirotaka Nishino | 2003-03-25 |
| 6504227 | Passive semiconductor device mounted as daughter chip on active semiconductor device | Mie Matsuo, Noriaki Matsunaga, Katsuya Okumura | 2003-01-07 |
| 6475285 | Deposition apparatus | Hiroshi Ikegami, Shinichi Ito, Katsuya Okumura | 2002-11-05 |
| 6440843 | Semiconductor device and method for manufacturing the same | Junichi Wada, Atsuko Sakata, Tomio Katata, Takamasa Usui, Masahiko Hasunuma +3 more | 2002-08-27 |
| 6419557 | Polishing method and polisher used in the method | Haruki Nojo, Rempei Nakata, Masako Kodera | 2002-07-16 |
| 6409780 | Water-laden solid matter of vapor-phase processed inorganic oxide particles and slurry for polishing and manufacturing method of semiconductor devices | Hiroyuki Yano, Katsuya Okumura, Akira Iio, Masayuki Hattori, Kiyonobu Kubota | 2002-06-25 |
| 6376894 | Semiconductor device | Hiroshi Ikegami, Keiichi Sasaki | 2002-04-23 |
| 6375545 | Chemical mechanical method of polishing wafer surfaces | Hiroyuki Yano, Gaku Minamihaba, Yukiteru Matsui, Katsuya Okumura, Akira Iio +2 more | 2002-04-23 |
| 6334928 | Semiconductor processing system and method of using the same | Makoto Sekine, Katsuya Okumura | 2002-01-01 |
| 6333215 | Method for manufacturing a semiconductor device | Tetsuo Matsuda | 2001-12-25 |
| 6306756 | Method for production of semiconductor device | Masahiko Hasunuma, Sachiyo Ito, Keizo Shimamura, Hisashi Kaneko, Junsei Tsutsumi +3 more | 2001-10-23 |
| 6239495 | Multichip semiconductor device and memory card | Koji Sakui, Junichi Miyamoto, Katsuya Okumura | 2001-05-29 |
| 6235624 | Paste connection plug, burying method, and semiconductor device manufacturing method | Keiichi Sasaki, Manabu Kimura | 2001-05-22 |
| 6224464 | Polishing method and polisher used in the method | Haruki Nojo, Rempei Nakata, Masako Kodera | 2001-05-01 |
| 6164295 | CVD apparatus with high throughput and cleaning method therefor | Akio Ui, Naruhiko Kaji, Hideshi Miyajima | 2000-12-26 |
| 6165617 | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil | Tetsurou Satoh, Hiroaki Tsuyoshi | 2000-12-26 |
| 6096631 | Method of manufacturing semiconductor device | Kenro Nakamura, Rempei Nakata, Yusuke Kohyama | 2000-08-01 |
| 6090701 | Method for production of semiconductor device | Masahiko Hasunuma, Sachiyo Ito, Keizo Shimamura, Hisashi Kaneko, Junsei Tsutsumi +3 more | 2000-07-18 |