Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6187416 | Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board | Tsutomu Asai | 2001-02-13 |
| 6165617 | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil | Hiroaki Tsuyoshi, Nobuo Hayasaka | 2000-12-26 |