Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10280501 | Roughened copper foil, copper clad laminate, and printed circuit board | Satoshi Mogi | 2019-05-07 |
| 9338898 | Method of producing a printed wiring board | Joji Fujii, Hiroto IIDA, Kazuhiro Yoshikawa, Mitsuyoshi Matsuda | 2016-05-10 |
| 6165617 | Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil | Tetsurou Satoh, Nobuo Hayasaka | 2000-12-26 |
| 5800722 | Multilayer printed wiring board and process for manufacturing the same | Tetsuro Sato | 1998-09-01 |