Issued Patents All Time
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12377887 | Fire-resistant floor structure of railroad vehicle | Hiroki Uchikawa, Atsushi Shirai, Yuta Mano | 2025-08-05 |
| 12351698 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Toshihiro Hosoi, Kenshiro FUKUDA, Yoshihiro Yoneda, Tomohiro Ishino | 2025-07-08 |
| 12139592 | Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor element | Toshihiro Hosoi, Yoshihiro Yoneda, Hitohiko Ide, Hiromi Matsuura, Kouichi Kawaratani | 2024-11-12 |
| 11959775 | Information processing device and information processing method that enable simple calibration | Masato Kimishima, Kosei Yamashita, Toru Amano | 2024-04-16 |
| 11947119 | Display control device, display control method, and recording medium | Yasutaka Fukumoto | 2024-04-02 |
| 11935865 | Semiconductor package manufacturing method, and adhesive sheet used therein | Toshimi Nakamura | 2024-03-19 |
| 11890853 | Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi | 2024-02-06 |
| 11876070 | Semiconductor package manufacturing method | Toshimi Nakamura | 2024-01-16 |
| 11525073 | Multilayer circuit board manufacturing method | Yoshinori Matsuura, Toshimi Nakamura, Takenori Yanai | 2022-12-13 |
| 11527415 | Multilayer circuit board manufacturing method | Yoshinori Matsuura, Takenori Yanai, Toshimi Nakamura | 2022-12-13 |
| 11458400 | Information processing device, information processing method, and program for generating an added related to a predicted future behavior | — | 2022-10-04 |
| 11419210 | Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board | Toshifumi Matsushima | 2022-08-16 |
| 10559102 | Makeup simulation assistance apparatus, makeup simulation assistance method, and non-transitory computer-readable recording medium storing makeup simulation assistance program | Hiroki Taoka, Sachiko Takeshita, Rieko Asai | 2020-02-11 |
| 10538256 | Railcar | Kentaro Hayashi, Naoshige Matsuo | 2020-01-21 |
| 10457297 | Railcar | Kentaro Hayashi, Naoshige Matsuo | 2019-10-29 |
| 9798921 | Wrinkle care support device and method for supporting wrinkle care | MASAYO SHINODA, Rieko Asai, Chie Nishi, Kaori Ajiki, Tomofumi Yamanashi | 2017-10-24 |
| 9453762 | Communication light detector | Kanako Suzuki | 2016-09-27 |
| 9216472 | Friction stir welding apparatus comprising slide plates | Yasuhiro Sakamoto, Tomonori Miyamichi, Toshiyuki Suda | 2015-12-22 |
| 9185130 | Transmission apparatus, reception apparatus, communication system, transmission method, and reception method | — | 2015-11-10 |
| 8815387 | Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer | Toshifumi Matsushima | 2014-08-26 |
| 8497026 | Porous metal foil and production method therefor | Tetsuhiro Matsunaga, Hajime Watanabe, Joe Nishikawa | 2013-07-30 |
| 8431224 | Resin composition for forming insulating layer of printed wiring board | Toshifumi Matsushima | 2013-04-30 |
| 8304091 | Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof | Tetsuhiro Matsunaga, Toshifumi Matsushima, Kensuke Nakamura, Hiroyuki Kon, Kenichiro Iwakiri | 2012-11-06 |
| 7927453 | Method of manufacturing copper foil with insulating layer, copper foil with insulating layer obtained with the same method, and printed circuit board using the same copper foil with insulating layer | Noriyuki Nagashima | 2011-04-19 |
| 7485361 | Multilayered printed wiring board and manufacturing method thereof | Kensuke Nakamura | 2009-02-03 |