Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10645809 | Surface-treated copper foil, method for producing same, copper-clad laminate for printed wiring board, and printed wiring board | Yoshinori Matsuura, Hiroaki Kurihara | 2020-05-05 |
| 9595719 | Composite metal foil and production method therefor | Tetsuhiro Matsunaga, Hajime Watanabe | 2017-03-14 |
| 9512527 | Reinforced porous metal foil and process for production thereof | Tetsuhiro Matsunaga, Hajime Watanabe | 2016-12-06 |
| 8980438 | Porous metal foil and production method therefor | Tetsuhiro Matsunaga, Hajime Watanabe | 2015-03-17 |
| 8497026 | Porous metal foil and production method therefor | Tetsuhiro Matsunaga, Hajime Watanabe, Tetsuro Sato | 2013-07-30 |