Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9595719 | Composite metal foil and production method therefor | Hajime Watanabe, Joe Nishikawa | 2017-03-14 |
| 9512527 | Reinforced porous metal foil and process for production thereof | Joe Nishikawa, Hajime Watanabe | 2016-12-06 |
| 8980438 | Porous metal foil and production method therefor | Hajime Watanabe, Joe Nishikawa | 2015-03-17 |
| 8497026 | Porous metal foil and production method therefor | Hajime Watanabe, Joe Nishikawa, Tetsuro Sato | 2013-07-30 |
| 8304091 | Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof | Toshifumi Matsushima, Tetsuro Sato, Kensuke Nakamura, Hiroyuki Kon, Kenichiro Iwakiri | 2012-11-06 |
| 8187723 | Surface-treated copper foil, manufacturing method of the surface-treated copper foil, and surface-treated copper foil coated with very thin primer resin layer | — | 2012-05-29 |
| 7524552 | Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer | Toshiko Yokota, Susumu Takahashi, Hideaki Matsushima, Takuya Yamamoto, Makoto Dobashi | 2009-04-28 |