Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7524552 | Copper foil provided with dielectric layer for forming capacitor layer, copper clad laminate for formation of capacitor layer using such copper foil with dielectric layer, and method for manufacturing producing such copper foil with dielectric layer for formation of capacitor layer | Tetsuhiro Matsunaga, Susumu Takahashi, Hideaki Matsushima, Takuya Yamamoto, Makoto Dobashi | 2009-04-28 |
| 6835297 | High current density electrolytic decomposition process for copper | Susumu Takahashi, Makoto Dobashi, Yoshiaki Kinoshita | 2004-12-28 |
| 6322904 | Copper foil for printed circuit boards | Makoto Dobashi, Hiroaki Kurihara, Hiroshi Hata, Naotomi Takahashi, Tatsuya Sudo | 2001-11-27 |
| 6194056 | High tensile strength electrodeposited copper foil | Hisao Sakai, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi +1 more | 2001-02-27 |
| 6071629 | Organic rust-proof treated copper foil | Makoto Dobashi, Hiroshi Hata, Hisao Sakai, Susumu Takahashi, Junshi Yoshioka | 2000-06-06 |
| 5958209 | High tensile strength electrodeposited copper foil and process of electrodepositing thereof | Hisao Sakai, Tsutomu Asai, Susumu Takahashi, Mitsuo Suzuki, Makoto Dobashi +1 more | 1999-09-28 |