Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8715836 | Surface-treated electro-deposited copper foil and method for manufacturing the same | Makoto Dobashi, Mitsuyoshi Matsuda, Sakiko Tomonaga, Hisao Sakai, Tomohiro Sakata +2 more | 2014-05-06 |
| 8419920 | Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film | Sakiko Tomonaga, Makoto Dobashi, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai | 2013-04-16 |
| 7217464 | Method of manufacturing electrodeposited copper foil with carrier foil for high-temperature heat-resistance and electrodeposited copper foil with carrier foil for high-temperature heat-resistance obtained by the manufacturing method | Akitoshi Takanashi, Kenichiro Iwakiri, Akiko Sugimoto, Shinichi Obata, Makoto Dobashi | 2007-05-15 |
| 6984453 | Electrolyte copper foil having carrier foil, manufacturing method thereof, and layered plate using the electrolyte copper foil having carrier foil | Akiko Sugimoto, Makoto Dobashi | 2006-01-10 |
| 6610418 | Electolytic copper foil with carrier foil and method for manufacturing the same | Akiko Sugimoto, Makoto Dobashi, Ken Iwakiri, Yutaka Hirasawa | 2003-08-26 |
| 6541126 | Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil | Akiko Sugimoto, Sakiko Taenaka, Makoto Dobashi, Tsutomu Higuchi, Takuya Yamamoto +1 more | 2003-04-01 |
| 6270889 | Making and using an ultra-thin copper foil | Takashi Kataoka, Yutaka Hirasawa, Takuya Yamamoto, Kenichiro Iwakiri, Akiko Sugioka | 2001-08-07 |
| 6183880 | Composite foil of aluminum and copper | Shinichi Obata, Makoto Dobashi, Takashi Kataoka | 2001-02-06 |
| 6071629 | Organic rust-proof treated copper foil | Toshiko Yokota, Makoto Dobashi, Hiroshi Hata, Hisao Sakai, Susumu Takahashi | 2000-06-06 |