Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9138964 | Surface-treated copper foil | Shinichi Obata, Shinya Hiraoka, Fumiaki Hosokoshi, Ayumu Tateoka, Hideaki Matsushima +2 more | 2015-09-22 |
| 8722199 | Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil | Mitsuyoshi Matsuda, Hisao Sakai, Makoto Dobashi | 2014-05-13 |
| 8715836 | Surface-treated electro-deposited copper foil and method for manufacturing the same | Makoto Dobashi, Mitsuyoshi Matsuda, Hisao Sakai, Tomohiro Sakata, Junshi Yoshioka +2 more | 2014-05-06 |
| 8419920 | Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film | Makoto Dobashi, Junshi Yoshioka, Ayumu Tateoka, Mitsuyoshi Matsuda, Hisao Sakai | 2013-04-16 |
| 7029558 | Titanium-made cathode electrode for producing electrolytic copper foil, rotary cathode drum using the titanium-made cathode electrode, method of producing titanium material using titanium-made cathode electrode and method of correcting/working titanium material for titanium-made cathode electrode | Satoru Fujita, Hiroshi Tanaka, Yutaka Kiminami, Isamu Kanekatsu, Atsuhiko Kuroda | 2006-04-18 |