Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12331212 | Resin composition, copper foil with resin, and printed wiring board | Kazuhiro OOSAWA, Kuniharu OGAWA, Haruka MAKINO | 2025-06-17 |
| 12104265 | Roughened copper foil, copper-clad laminate and printed wiring board | Tsubasa Kato, Shota KAWAGUCHI, Po-Chun Yang | 2024-10-01 |
| 10863621 | Metal foil with releasing resin layer, and printed wiring board | Toshifumi Matsushima, Fujio Kuwako, Shigeru Itabashi | 2020-12-08 |
| 10244640 | Copper clad laminate provided with protective layer and multilayered printed wiring board | Fujio Kuwako, Toshifumi Matsushima, Toshihiro Hosoi | 2019-03-26 |
| 10244635 | Production method for copper-clad laminate plate | Makoto Hosokawa, Shota KAWAGUCHI | 2019-03-26 |
| 9585261 | Manufacturing method of multilayer printed wiring board | Shinichi Obata, Toshiyuki Shimizu | 2017-02-28 |
| 9138964 | Surface-treated copper foil | Shinichi Obata, Shinya Hiraoka, Fumiaki Hosokoshi, Hideaki Matsushima, Koichi Miyake +2 more | 2015-09-22 |
| 9066459 | Manufacturing method of multilayer printed wiring board | Shinichi Obata, Toshiyuki Shimizu | 2015-06-23 |
| 8419920 | Method of preparing electrolytic copper solution acidified with sulfuric acid, sulfuric-acid-acidified electrolytic copper solution prepared by the preparation method, and electrodeposited copper film | Sakiko Tomonaga, Makoto Dobashi, Junshi Yoshioka, Mitsuyoshi Matsuda, Hisao Sakai | 2013-04-16 |