TH

Toshihiro Hosoi

MC Mitsui Mining & Smelting Co.: 12 patents #29 of 838Top 4%
DE Denso: 2 patents #4,986 of 11,792Top 45%
TC Toyoda Gosei Co.: 1 patents #1,271 of 2,296Top 60%
Overall (All Time): #307,771 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12351698 Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor Kenshiro FUKUDA, Yoshihiro Yoneda, Tomohiro Ishino, Tetsuro Sato 2025-07-08
12297354 Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor Yoshihiro Yoneda, Kenshiro FUKUDA, Toshifumi Matsushima 2025-05-13
12176150 Double-sided copper-clad laminate Ryuji ISHIZUKA, Yoshihiro Yoneda, Yuji Kageyama 2024-12-24
12139592 Resin composition comprising coated metal oxide particles, resin-attached metal foil, metal-clad laminated sheet, and capacitor element Yoshihiro Yoneda, Tetsuro Sato, Hitohiko Ide, Hiromi Matsuura, Kouichi Kawaratani 2024-11-12
11950376 Copper-clad laminate Toshifumi Matsushima 2024-04-02
11890853 Resin layered product, dielectric layer, metal foil with resin, capacitor element, and printed wiring board with built-in capacitor Yoshihiro Yoneda, Tetsuro Sato 2024-02-06
11670455 Double-sided copper-clad laminate Ryuji ISHIZUKA, Yoshihiro Yoneda, Yuji Kageyama 2023-06-06
11310910 Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor Yoshihiro Yoneda, Toshifumi Matsushima, Kenshiro FUKUDA 2022-04-19
11166383 Resin-clad copper foil, copper-clad laminated plate, and printed wiring board Yoshihiro Yoneda, Toshifumi Matsushima, Fujio Kuwako 2021-11-02
10524360 Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board Fujio Kuwako, Toshifumi Matsushima 2019-12-31
10244640 Copper clad laminate provided with protective layer and multilayered printed wiring board Fujio Kuwako, Toshifumi Matsushima, Ayumu Tateoka 2019-03-26
10134264 Emergency report apparatus Shinichi Yokoi 2018-11-20
9924597 Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board Fujio Kuwako, Toshifumi Matsushima 2018-03-20
8684399 Gas generator and airbag apparatus Kensaku Honda, Yuji Sato, Takashi Iida, Yoshiaki Goto, Masashi Hotta +6 more 2014-04-01
7756265 On-board hands-free communication apparatus 2010-07-13