Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12351698 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Toshihiro Hosoi, Yoshihiro Yoneda, Tomohiro Ishino, Tetsuro Sato | 2025-07-08 |
| 12297354 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi, Toshifumi Matsushima | 2025-05-13 |
| 11310910 | Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshifumi Matsushima, Toshihiro Hosoi | 2022-04-19 |