Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12297354 | Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi, Kenshiro FUKUDA | 2025-05-13 |
| 11950376 | Copper-clad laminate | Toshihiro Hosoi | 2024-04-02 |
| 11419210 | Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board | Tetsuro Sato | 2022-08-16 |
| 11310910 | Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor | Yoshihiro Yoneda, Toshihiro Hosoi, Kenshiro FUKUDA | 2022-04-19 |
| 11166383 | Resin-clad copper foil, copper-clad laminated plate, and printed wiring board | Yoshihiro Yoneda, Toshihiro Hosoi, Fujio Kuwako | 2021-11-02 |
| 10863621 | Metal foil with releasing resin layer, and printed wiring board | Ayumu Tateoka, Fujio Kuwako, Shigeru Itabashi | 2020-12-08 |
| 10524360 | Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board | Fujio Kuwako, Toshihiro Hosoi | 2019-12-31 |
| 10342143 | Production method for printed wiring board having dielectric layer | Toshiyuki Shimizu, Yoshihiro Yoneda | 2019-07-02 |
| 10244640 | Copper clad laminate provided with protective layer and multilayered printed wiring board | Fujio Kuwako, Toshihiro Hosoi, Ayumu Tateoka | 2019-03-26 |
| 9924597 | Copper clad laminate for forming of embedded capacitor layer, multilayered printed wiring board, and manufacturing method of multilayered printed wiring board | Fujio Kuwako, Toshihiro Hosoi | 2018-03-20 |
| 8815387 | Copper foil with ultra thin adhesive layer, and a method for manufacturing the copper foil with ultra thin adhesive layer | Tetsuro Sato | 2014-08-26 |
| 8431224 | Resin composition for forming insulating layer of printed wiring board | Tetsuro Sato | 2013-04-30 |
| 8304091 | Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof | Tetsuhiro Matsunaga, Tetsuro Sato, Kensuke Nakamura, Hiroyuki Kon, Kenichiro Iwakiri | 2012-11-06 |
| 6905757 | DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE | Hideaki Miwa, Akira Ichiryu, Kazuhiro Yamazaki, Tetsuro Sato, Fujio Kuwako | 2005-06-14 |
| 6831129 | Resin-coated copper foil, and printed wiring board using resin-coated copper foil | Tetsuro Sato, Tsutomu Asai | 2004-12-14 |
| 6693793 | Double-sided copper clad laminate for capacitor layer formation and its manufacturing method | Fujio Kuwako, Kazuhiro Yamazaki | 2004-02-17 |