Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432841 | Dielectric barrier discharge plasma generator | Takahiro Hiraoka | 2025-09-30 |
| 12219688 | Dielectric barrier plasma generator and plasma discharge starting method for dielectric barrier plasma generator | Takahiro Hiraoka, Takanori Samejima | 2025-02-04 |
| 9707847 | Braking control device and control method | Keigo Ajiro, Takuya Higuchi | 2017-07-18 |
| 9349714 | Method of manufacturing semiconductor device, block stacked body, and sequential stacked body | Toru Meura, Yoji Ishimura | 2016-05-24 |
| 9123830 | Manufacturing method for semiconductor device | Toru Meura, Yoji Ishimura | 2015-09-01 |
| 9002609 | Vehicle brake control system | Noriaki Fujiki, Keigo Ajiro | 2015-04-07 |
| 8871660 | Laminated body, circuit board including laminated body, semiconductor package and process for manufacturing laminated body | Kazuyuki Yoshizaki, Teppei Ito, Iji Onozuka | 2014-10-28 |
| 8592994 | Semiconductor package, core layer material, buildup layer material, and sealing resin composition | Kenya Tachibana, Masahiro Wada, Hitoshi Kawaguchi | 2013-11-26 |
| 8304091 | Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof | Tetsuhiro Matsunaga, Toshifumi Matsushima, Tetsuro Sato, Hiroyuki Kon, Kenichiro Iwakiri | 2012-11-06 |
| 8227703 | Multilayered circuit board and semiconductor device | Hironori Maruyama, Toru Meura, Hiroshi Hirose | 2012-07-24 |
| 8205329 | Method for manufacturing dielectric layer constituting material, dielectric layer constituting material obtained thereby; method for manufacturing capacitor circuit forming piece using dielectric layer constituting material, capacitor circuit forming piece obtained thereby; and multi-layer printed wiring board obtained by using dielectric layer constituting material and/or capacitor circuit forming piece | Kazuhiro Yamazaki | 2012-06-26 |
| 8062539 | Method for manufacturing multilayer printed wiring board and multilayer printed wiring board obtained by the same | — | 2011-11-22 |
| 7859110 | Solder resist material, wiring board using the solder resist material, and semiconductor package | Hiroshi Hirose | 2010-12-28 |
| 7485361 | Multilayered printed wiring board and manufacturing method thereof | Tetsuro Sato | 2009-02-03 |
| 7331502 | Method of manufacturing electronic part and electronic part obtained by the method | Ryoichi Okada, Hitoshi Aoki, Yoshitaka Okugawa, Shinichiro Itoh | 2008-02-19 |
| 6808467 | Blade tensioner and system for a chain | Hiroyuki Takeda, Shinji Tsuruta, Hiroyoshi Mitsuhashi, Sadao Kojima, Akira Terao +2 more | 2004-10-26 |
| 6768197 | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device | Takeshi Hosomi, Ryouichi Okada, Toyosei Takahashi | 2004-07-27 |
| 6620067 | Tensioner device | Sadao Kojima, Atsushi Tanaka, Shinji Yamada, Hajime Maeda, Hidehiko Kamiyama | 2003-09-16 |
| 6483195 | Transfer bump street, semiconductor flip chip and method of producing same | Hitoshi Aoki, Takeshi Hosomi, Hideki Hara, Masaaki Kato | 2002-11-19 |
| 6364796 | Blade chain tensioner | Ryohei Adachi, Naosumi Tada, Shinji Tsuruta | 2002-04-02 |
| 6332441 | Assembling arrangement for tensioner and hydraulic control valve | Izumi Sugiyama, Toshiyuki Satou | 2001-12-25 |
| 6308679 | Separator structure of chain case | Fuminori Kawashima, Hidehiko Kamiyama | 2001-10-30 |
| 5913742 | Tensioner for an endless transmitting member | Kouji Hirano, Tomoki Okita, Shinji Yamada, Fuminori Kawashima | 1999-06-22 |
| 5803854 | Silent chain having a sheared link bearing surface | Naosumi Tada, Kazushige Yakubo, Yoshiyuki Ohtaka | 1998-09-08 |
| 5788381 | Rotary shaft lubricating structure | Masakazu Yamazaki, Fuminori Kawashima, Chiharu Shimizu, Nobuyoshi Takamatsu, Toru Kano +2 more | 1998-08-04 |