Issued Patents All Time
Showing 1–25 of 93 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344174 | Partitioned junction box with two interconnected lids | Takaaki Kakimi, Kazuki Shoji, Kengo Aono | 2025-07-01 |
| 12312809 | Gypsum-based load-bearing board, load-bearing wall structure, and load-bearing wall construction method for wooden construction building | Ushio Sudo, Wataru Nakamura, Tomoya Hasegawa, Muneyoshi Nagano, Katsumi Tada +2 more | 2025-05-27 |
| 12249819 | Electric junction box | Takaaki Kakimi, Kazuki Shoji, Kengo Aono | 2025-03-11 |
| 12249820 | Electric junction box | Takaaki Kakimi, Kazuki Shoji, Kengo Aono | 2025-03-11 |
| 11600977 | Resin structure | Takaaki Kakimi, Takao Nogaki, Kazuki Shoji, Takehisa Shimma | 2023-03-07 |
| 11538712 | Suction holder and holding mechanism for ring frame | Naohisa Watanabe | 2022-12-27 |
| 11464122 | Lock structure, electrical connection box, and wire harness | Hiroki Tashiro, Ryouichi Yokoyama | 2022-10-04 |
| 11318625 | Ring frame holding mechanism | Naohisa Watanabe | 2022-05-03 |
| 10943811 | Tape affixing apparatus | Hiroshi Yoshimura, Toshiyasu Rikiishi | 2021-03-09 |
| 10850686 | Electrical connection box and wire harness | Hiroki Tashiro, Ryouichi Yokoyama | 2020-12-01 |
| 10333287 | Clearance filling structure of accommodation box, electric connection box, and wire harness | Akinori Nakashima, Daisuke Kawada | 2019-06-25 |
| 10096982 | Electrical connection box | Akinori Nakashima, Takahiko Kamiya, Norihisa Miyabe | 2018-10-09 |
| 9960181 | Three-dimensional memory device having contact via structures in overlapped terrace region and method of making thereof | Zhixin Cui | 2018-05-01 |
| 9368354 | Semiconductor device and method of manufacturing the same | — | 2016-06-14 |
| 9272922 | Inorganic iodide, production method thereof, and production system thereof | Satoshi Kanbe, Kazumi Hosono | 2016-03-01 |
| 8883883 | Resin composition for encapsulating semiconductor and semiconductor device | — | 2014-11-11 |
| 8809478 | Silicon-containing curable composition, cured product of the silicon-containing curable composition and lead frame substrate formed of the silicon-containing curable composition | Masako Saito, Ichiro Hiratsuka, Ryota Chiba, Takuya Kanazawa, Osamu Yoshioka +2 more | 2014-08-19 |
| 8747710 | Method for producing porous body | Tetsuji Tsujimoto, Takumi Shibuya, Hiroki Ueno, Sakae Akiyama | 2014-06-10 |
| 8653205 | Resin composition for encapsulating semiconductor and semiconductor device | — | 2014-02-18 |
| 8629556 | Semiconductor device | Mitsuo Sugino, Takeshi Hosomi, Masataka Arai | 2014-01-14 |
| 8592994 | Semiconductor package, core layer material, buildup layer material, and sealing resin composition | Kenya Tachibana, Hitoshi Kawaguchi, Kensuke Nakamura | 2013-11-26 |
| 8582366 | Semiconductor device using charge pump circuit | — | 2013-11-12 |
| 8552572 | Resin composition for encapsulating semiconductor and semiconductor device using the same | — | 2013-10-08 |
| 8502399 | Resin composition for encapsulating semiconductor and semiconductor device | — | 2013-08-06 |
| 8493605 | Print control apparatus that acquires user position information of a portable terminal | — | 2013-07-23 |