Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12295394 | Water-soluble additive composition | Ryuichi Murata, Yusuke Inoue, Daisuke Fujiwara, Hiroyuki Miyauchi | 2025-05-13 |
| 8592994 | Semiconductor package, core layer material, buildup layer material, and sealing resin composition | Masahiro Wada, Hitoshi Kawaguchi, Kensuke Nakamura | 2013-11-26 |
| 8008767 | Semiconductor device | Masahiro Wada, Hiroyuki Tanaka, Hiroshi Hirose, Teppei Itoh | 2011-08-30 |
| 7893542 | Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board | Masahiro Wada, Takuya Hatao | 2011-02-22 |