Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7893542 | Connecting structure for flip-chip semiconductor package, build-up layer material, sealing resin composition, and circuit board | Kenya Tachibana, Masahiro Wada | 2011-02-22 |
| 6297351 | Polybenzoxazole resin and precursor thereof | Mitsumoto Murayama, Toshimasa Egucih, Takashi Yamaji, Nobuhiro Higashida, Yoko Mizumoto | 2001-10-02 |
| 6114497 | Polybenzoxazole resin and precursor thereof | Masahiro Tada, Mitsumoto Murayama, Takashi Yamaji | 2000-09-05 |