Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11348849 | Semiconductor apparatus and method for manufacturing same | — | 2022-05-31 |
| 9711460 | Semiconductor device | — | 2017-07-18 |
| 9693462 | Printed circuit board | — | 2017-06-27 |
| 8629556 | Semiconductor device | Mitsuo Sugino, Masahiro Wada, Masataka Arai | 2014-01-14 |
| 8110444 | Prepreg, method for manufacturing prepreg, substrate, and semiconductor device | Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba | 2012-02-07 |
| 8044505 | Prepreg, method for manufacturing prepreg, substrate, and semiconductor device | Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba | 2011-10-25 |
| 7759794 | Semiconductor device | Mitsuo Sugino, Yushi Sakamoto | 2010-07-20 |
| 7655871 | Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board | Masataka Arai, Hiroaki Wakabayashi | 2010-02-02 |
| 7368497 | Resin composition, prepreg, laminate, and semiconductor package | Masako Yamashita, Takayuki Baba, Kentaro Yabuki | 2008-05-06 |
| 6768197 | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device | Ryouichi Okada, Kensuke Nakamura, Toyosei Takahashi | 2004-07-27 |
| 6483195 | Transfer bump street, semiconductor flip chip and method of producing same | Hitoshi Aoki, Kensuke Nakamura, Hideki Hara, Masaaki Kato | 2002-11-19 |
| 5976699 | Insulating adhesive for multilayer printed circuit board | Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui | 1999-11-02 |
| 5854325 | Photosensitive adhesive composition for additive plating | Hiroshi Hayai, Takayuki Baba | 1998-12-29 |
| 5806177 | Process for producing multilayer printed circuit board | Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui | 1998-09-15 |
| 5756190 | Undercoating agent for multilayer printed circuit board | Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi, Masahiro Mitsui | 1998-05-26 |
| 5726219 | Resin composition and printed circuit board using the same | Hiroshi Hayai, Takayuki Baba | 1998-03-10 |
| 5110988 | Nonlinear optical material | Seizo Miyata, Toshio Suzuki, Toshiyuki Watanabe, Hironobu Yamamoto, Akio Hayashi | 1992-05-05 |