Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6042362 | Thermosetting resin injection molding machine | — | 2000-03-28 |
| 5976699 | Insulating adhesive for multilayer printed circuit board | Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi | 1999-11-02 |
| 5806177 | Process for producing multilayer printed circuit board | Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi | 1998-09-15 |
| 5756190 | Undercoating agent for multilayer printed circuit board | Takeshi Hosomi, Toyoaki Kishi, Tomoyoshi Honjoya, Sei Nakamichi | 1998-05-26 |