NF

Noriaki Fujiki

Mitsubishi Electric: 8 patents #3,714 of 25,717Top 15%
Nissan Motor Co.: 6 patents #1,257 of 8,689Top 15%
RT Renesas Technology: 5 patents #592 of 3,337Top 20%
Micron: 4 patents #2,657 of 6,345Top 45%
Overall (All Time): #181,262 of 4,157,543Top 5%
23
Patents All Time

Issued Patents All Time

Showing 1–23 of 23 patents

Patent #TitleCo-InventorsDate
12125789 Semiconductor device and method of forming the same Shigeru Sugioka, Hidenori Yamaguchi, Keizo Kawakita, Raj K. Bansal 2024-10-22
11658121 Semiconductor device and method of forming the same Shigeru Sugioka, Hidenori Yamaguchi, Keizo Kawakita 2023-05-23
11587870 Apparatus comprising aluminum interconnections, memory devices comprising interconnections, and related methods Shigeru Sugioka, Keizo Kawakita, Takahisa Ishino 2023-02-21
11456253 Semiconductor device and method of forming the same Shigeru Sugioka, Hidenori Yamaguchi, Keizo Kawakita, Raj K. Bansal 2022-09-27
10604150 Vehicle stop position setting apparatus and method 2020-03-31
10509408 Drive planning device, travel assistance apparatus, and drive planning method Motonobu Aoki, Susumu Fujita, Hikaru Nishira 2019-12-17
10074275 Scene determination device, travel assistance apparatus, and scene determination method Motonobu Aoki, Tomoko Kurotobi, Susumu Fujita, Hikaru Nishira 2018-09-11
9452747 Vehicle braking control device 2016-09-27
9002609 Vehicle brake control system Kensuke Nakamura, Keigo Ajiro 2015-04-07
8670914 Vehicle brake control system Keigo Ajiro, Takuya Higuchi 2014-03-11
7423301 Semiconductor device including fuse elements and bonding pad Takashi Yamashita, Junko Izumitani 2008-09-09
7335537 Method of manufacturing semiconductor device including bonding pad and fuse elements Takashi Yamashita, Junko Izumitani 2008-02-26
7217965 Semiconductor device including fuse elements and bonding pad Takashi Yamashita, Junko Izumitani 2007-05-15
6888258 Semiconductor device including copper interconnect line and bonding pad, and method of manufacturing the same Takeru Matsuoka, Hiroki Takewaka 2005-05-03
6677682 Multilayer interconnection structure including an alignment mark Shigeru Harada, Takashi Yamashita 2004-01-13
6586838 Semiconductor device Takeru Matsuoka, Hiroki Takewaka 2003-07-01
6339257 Semiconductor device Takashi Yamashita, Shigeru Harada, Kazunobu Miki 2002-01-15
6283835 Method and apparatus for manufacturing a semiconductor integrated circuit Shigeru Harada, Takashi Yamashita, Tsutomu Tanaka 2001-09-04
6178972 Method and apparatus for manufacturing a semiconductor integrated circuit Shigeru Harada, Takashi Yamashita, Tsutomu Tanaka 2001-01-30
5736791 Semiconductor device and bonding pad structure therefor Takashi Yamashita 1998-04-07
5510653 Semiconductor device including silicon ladder resin layer Shigeru Harada, Hiroshi Adachi, Etsushi Adachi 1996-04-23
5488014 Interconnection structure of semiconductor integrated circuit device and manufacturing method thererfor Shigeru Harada, Junichi Arima 1996-01-30
5313101 Interconnection structure of semiconductor integrated circuit device Shigeru Harada, Junichi Arima 1994-05-17