JI

Junko Izumitani

MC Murata Manufacturing Co.: 9 patents #868 of 5,295Top 20%
Mitsubishi Electric: 5 patents #5,859 of 25,717Top 25%
RT Renesas Technology: 5 patents #592 of 3,337Top 20%
MD Mitsubisih Denki: 1 patents #26 of 381Top 7%
RE Renesas Electronics: 1 patents #2,739 of 4,529Top 65%
RE Ryoden Semiconductor System Engineering: 1 patents #111 of 195Top 60%
Overall (All Time): #205,375 of 4,157,543Top 5%
21
Patents All Time

Issued Patents All Time

Showing 1–21 of 21 patents

Patent #TitleCo-InventorsDate
11587738 Capacitor Masatomi Harada, Takeshi Kagawa, Hiroshi Matsubara 2023-02-21
11521800 Capacitor Takeshi Kagawa, Masatomi Harada, Nobuhiro Ishida 2022-12-06
11474063 Semiconductor device having a porous metal oxide film and a semiconductor substrate with a connection electrically connected to the porous metal oxide film Hiroshi Matsubara, Hideaki OOE, Masutaro Nemoto 2022-10-18
11476055 Thin film capacitor and method of manufacturing the same Takeshi Kagawa, Masatomi Harada, Hiroshi Matsubara, Nobuhiro Ishida 2022-10-18
11232911 Capacitor Nobuhiro Ishida, Masatomi Harada, Takeshi Kagawa 2022-01-25
11217395 Capacitor Masatomi Harada, Takeshi Kagawa, Hiroshi Matsubara 2022-01-04
11101072 Capacitor with limited substrate capacitance Masatomi Harada, Takeshi Kagawa, Nobuhiro Ishida 2021-08-24
11011548 Electronic device and method of manufacturing the same 2021-05-18
10177289 Mounting substrate Yuki FUKUI, Tadayuki Okawa 2019-01-08
8008730 Semiconductor device, and manufacturing method thereof Shoichi Fukui, Noboru Morimoto, Yasutaka Nishioka, Atsushi Ishii 2011-08-30
7423301 Semiconductor device including fuse elements and bonding pad Noriaki Fujiki, Takashi Yamashita 2008-09-09
7335537 Method of manufacturing semiconductor device including bonding pad and fuse elements Noriaki Fujiki, Takashi Yamashita 2008-02-26
7217965 Semiconductor device including fuse elements and bonding pad Noriaki Fujiki, Takashi Yamashita 2007-05-15
6890857 Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same Shigeru Harada, Yoshifumi Takata 2005-05-10
6727590 Semiconductor device with internal bonding pad Hiroki Takewaka 2004-04-27
6645863 Method of manufacturing semiconductor device and semiconductor device Hiroki Takewaka, Takao Kamoshima 2003-11-11
6500675 Manufacturing method of semiconductor device having capacitive element Yoshifumi Takata, Shigeki Sunada 2002-12-31
6476491 Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the same Shigeru Harada, Yoshifumi Takata 2002-11-05
6476496 Semiconductor device and method of manufacturing the same 2002-11-05
6333259 Semiconductor device and apparatus and method for manufacturing the same Kazuyoshi Maekawa 2001-12-25
6016562 Inspection data analyzing apparatus for in-line inspection with enhanced display of inspection results Yoko Miyazaki, Nobuyoshi Hattori, Masahiko Ikeno 2000-01-18