Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8716122 | Method of manufacturing semiconductor device having surface protective films on bond pad | Takuro Honma | 2014-05-06 |
| 8390134 | Semiconductor device having surface protective films on bond pad | Takuro Homma | 2013-03-05 |
| 6890857 | Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same | Shigeru Harada, Junko Izumitani | 2005-05-10 |
| 6777738 | Semiconductor integrated circuit | — | 2004-08-17 |
| 6727170 | Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof | Yuichi Sakai, Hiroyuki Chibahara, Masanobu Iwasaki | 2004-04-27 |
| 6500675 | Manufacturing method of semiconductor device having capacitive element | Junko Izumitani, Shigeki Sunada | 2002-12-31 |
| 6476491 | Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the same | Shigeru Harada, Junko Izumitani | 2002-11-05 |
| 6448658 | Semiconductor device having improved interconnection-wiring structures | Shigeru Harada, Hiroki Takewaka | 2002-09-10 |
| 6319812 | Method of manufacturing a semiconductor device | Masatoshi Anma, Yoshinori Tanaka | 2001-11-20 |
| 6278187 | Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof | Yuichi Sakai, Hiroyuki Chibahara, Masanobu Iwasaki | 2001-08-21 |
| 5712140 | Method of manufacturing interconnection structure of a semiconductor device | Atsushi Ishii, Akihiko Ohsaki, Kazuyoshi Maekawa | 1998-01-27 |
| 5561084 | Method of making an interconnection structure of a semiconductor device | — | 1996-10-01 |
| 5475267 | Multilayer interconnection structure for a semiconductor device | Atsushi Ishii, Akihiko Ohsaki, Kazuyoshi Maekawa | 1995-12-12 |
| 5442238 | Interconnection structure of a semiconductor device | — | 1995-08-15 |
| 5313100 | Multilayer interconnection structure for a semiconductor device | Atsushi Ishii, Akihiko Ohsaki, Kazuyoshi Maekawa | 1994-05-17 |
| 4962061 | Method for manufacturing a multilayer wiring structure employing metal fillets at step portions | — | 1990-10-09 |