Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11174402 | Thermosetting resin composition for LDS, resin molded article, and three-dimensional molded interconnect device | — | 2021-11-16 |
| 9349714 | Method of manufacturing semiconductor device, block stacked body, and sequential stacked body | Kensuke Nakamura, Yoji Ishimura | 2016-05-24 |
| 9123830 | Manufacturing method for semiconductor device | Kensuke Nakamura, Yoji Ishimura | 2015-09-01 |
| 8598719 | Semiconductor element mounting board | Mitsuo Sugino, Hideki Hara | 2013-12-03 |
| 8531028 | Method for manufacturing electronic component, and electronic component | Kenzou Maejima, Satoru Katsurayama | 2013-09-10 |
| 8389328 | Method of manufacturing electronic device and electronic device | Hiroki Nikaido, Kenzou Maejima, Yoji Ishimura | 2013-03-05 |
| 8269332 | Semiconductor element mounting board | Mitsuo Sugino, Hideki Hara | 2012-09-18 |
| 8227703 | Multilayered circuit board and semiconductor device | Hironori Maruyama, Kensuke Nakamura, Hiroshi Hirose | 2012-07-24 |
| 8079141 | Electrical connection and method of manufacturing the same | — | 2011-12-20 |